External Signals And Connections; Ui (Board-To-Board) Connector - Nokia NHM-7 series Service Manual

NHM–7
System Module & UI
Signal name From
TXIP / TXIN UEM
TXQP / UEM
TXQN
AFC UEM
Aux_DAC UEM
(TxC)
RFTemp RF
Vbase RF

External Signals and Connections

UI (board–to–board) connector
Pin Signal
1 SLOWAD(2)
2 VBAT
3 ROW(4)
Page 16
To Parameter
RF–IC Differential voltage
swing (static)
DC level
Source
Impedance
RF–IC Same spec as for TXIP / TXIN
VCTCXO Voltage Min
Max
Resolution
Load resistance
and capacitance
Step settling time
RF Voltage Min
Max
Source
Impedance
Resolution
Noise density
BW=100Hz...
100kHz
Temp Coef
UEM Voltage at –20
Voltage at +25
Voltage at +60
UEM Voltage
Min Nom
1.5V
0.1V
3.0V 3.6V
0.7xVIO
0
E Nokia Corporation
PAMS Technical Documentation
Min Typ Max
2.23 2.48
1.17 1.20 1.23
200
0.0 0.1
2.4 2.6
11
1
100
0.2
0.1
2.4
200
10
800
–65 +65
o
C 1,57
o
C 1,7
o
C 1,79
2.7
Max Condition
2.7V Flip closed
1.0V Flip open
4.2V
1.8V High
0.3xVIO Low
Unit Function
Vpp Programmable
voltage swing.
Programmable Programmable
V
common mode
voltage. voltage
ohm
Between
TXIP–TXIN
Differential
quadrature phase
TX baseband
signal for the RF
modulator
V Automatic
frequency control
signal for i l f
bits
VCTCXO
kohm
nF
ms
V Transmitter power
control
ohm
bits
nVrms/
NOTE; Assumed
sqrt(Hz)
power control
opamp G=1 o am G 1
uV/C
V Temperature
sensor of RF. f RF
V Detected voltage
from PA power
level sensing unit
Note
used for flip
identification
Battery voltage
for leds
Keyboard ma-
trix row 4
Issue 1 10/2001