Table of Contents
Advertisement
1.4.2 Core specifications
DDR DIMM sockets. These six 184-pin DIMM sockets support up
1
to 12GB system memory using registered ECC PC2100/1600 DDR
DIMMs.
2
ServerWorks
Bridge (CIOB-X2) provides a high performance data flow path
between the IMB and the I/O subsystem, which supports multiple
PCI-X interfaces that allows large, efficient, and flexible I/O
configurations. The CIOB-X2 supports dual 64-bit PCI-X I/O buses
that comply with PCI 2.2 specification. There are two CIOB-X2 on
the motherboard.
3
24/20-pin ATX power connector. This power connector is for an
ATX power supply.
4
ServerWorks
The Champion Memory and I/O Controller LE (CMIC-LE) acts as
the host bridge of the Grand Champion Low End (GCLE)
SystemSet. The CMIC-LE device interfaces directly to the
processor bus, and integrates the functions of the main memory
controller and the Inter Module Bus (IMB) interface unit. The
processor interface supports a 400MHz Front Side Bus (FSB)
providing a 3.2GB/s bandwidth, 2-way interleaved 3.2GB/s memory
bandwidth with up to 12GB registered ECC PC2100/1600 DDR
DIMMs, and two high speed IMBs plus one thin IMB to connect to
the south bridge CSB5.
5
DIP switches. This 5-switch Dual Inline Package (DIP) allows you
to set the CPU external frequency.
604-pin CPU sockets. A 604-pin surface mount, Zero Insertion
6
Force (ZIF) socket for the Intel
cache and a 400 MHz system bus that allows up to 3.2GB/s data
transfer rate.
7
8-pin 12V SSI power connector. This power connector is for an
ATX power supply.
IDE connectors. These dual-channel bus master IDE connectors
8
support up to four Ultra DMA/100/66, PIO Modes 3 & 4 IDE
devices. Both the primary (blue) and secondary (black) connectors
are slotted to prevent incorrect insertion of the IDE ribbon cable.
1-8
64-bit I/O Bridge (CIOB-X2). The Champion I/O
®
Grand Champion LE north bridge (CMIC-LE).
®
Xeon™ processor with 512KB L2
®
Chapter 1: Product introduction
Advertisement
Table of Contents
