HP ProLiant ML350p Gen8 Maintenance And Service Manual

HP ProLiant ML350p Gen8 Maintenance And Service Manual

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HP ProLiant ML350p Gen8 Server
Maintenance and Service Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is intended for experienced
IT professionals or end-users with no or prior hardware setup experience. HP assumes you are qualified in the servicing of computer equipment and
trained in recognizing hazards in products with hazardous energy levels.
Part Number: 661081-008
January 2014
Edition: 8

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Summary of Contents for HP ProLiant ML350p Gen8

  • Page 1 This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is intended for experienced IT professionals or end-users with no or prior hardware setup experience. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
  • Page 2 © Copyright 2012, 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
  • Page 3: Table Of Contents

    Contents Customer self repair ........................5 Parts only warranty service ......................... 5 Illustrated parts catalog ....................... 15 Mechanical components ........................... 15 System components ..........................18 Removal and replacement procedures ................... 24 Required tools ............................24 Safety considerations ..........................24 Preventing electrostatic discharge ....................24 Symbols on equipment ........................
  • Page 4 Power supply specifications ........................93 HP 460 W Gold Power Supply (92% efficiency) ................94 HP 460 W Platinum Plus Power Supply (94% efficiency) ..............94 HP 750 W Gold Power Supply (92% efficiency) ................95 HP 750 W Platinum Plus Power Supply (94% efficiency) ..............95 HP 1200 W Platinum Plus Power Supply (94% efficiency) ..............
  • Page 5: Customer Self Repair

    HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
  • Page 6 HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
  • Page 7 La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
  • Page 8 Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
  • Page 9 HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
  • Page 10 Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 11 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 11...
  • Page 12 Customer self repair 12...
  • Page 13 Customer self repair 13...
  • Page 14 Customer self repair 14...
  • Page 15: Illustrated Parts Catalog

    Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) Front bezel 667267-001 Mandatory Second optical drive cage 670612-001 Optional Fan cage 667255-001 Optional Fan blank 667262-001 Mandatory Fan louver 667258-001 Optional PCI air baffles (2) 667280-001 Mandatory System air baffle...
  • Page 16 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
  • Page 17 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 18: System Components

    5) Power supplies — — a) HP 460W CS Gold (92% efficiency) 511777-001 Mandatory b) HP 460 W CS Platinum Plus (94% 660184-001 Mandatory efficiency)* c) HP 750 W CS Gold (92% efficiency)* 511778-001 Mandatory d) HP 750 W CS Platinum Plus (94%...
  • Page 19 Item Description Spare part number Customer self repair (on page 5) g) 2.0 GHz Intel Xeon E5-2640v2 730239-001 Optional processor, 8C, 95 W* h) 2.1 GHz Intel Xeon E5-2620v2 730241-001 Optional processor, 6C, 80 W* i) 2.2 GHz Intel Xeon E5-2660 processor, 670525-001 Optional 8C, 95 W*...
  • Page 20 Item Description Spare part number Customer self repair (on page 5) c) 2 GB, PC3L-12800E-11, single-rank x8 715279-001 Mandatory d) 4 GB, PC3L-12800E-11, dual-rank x8 715280-001 Mandatory e) 4 GB, PC3L-12800R-11, single-rank x4 715282-001 Mandatory f) 4 GB, PC3-14900E-13, dual-rank x8 715270-001 Mandatory g) 4 GB, PC3-14900R-13, single-rank x4...
  • Page 21 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
  • Page 22 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 23 Illustrated parts catalog 23...
  • Page 24: Removal And Replacement Procedures

    You need the following items for some procedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 75) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
  • Page 25: Rack Warnings

    This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.
  • Page 26: Power Up The Server

    Extend the server from the rack (on page 28). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.
  • Page 27: Remove The Security Bezel

    Remove the security bezel Unlock the security bezel, press the latch on the security bezel, and then remove the security bezel. Remove the tower bezel This server has a removable bezel that must be unlocked and opened before accessing the hard drives. The bezel must be kept closed during normal server operations.
  • Page 28: Extend The Server From The Rack

    Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Extend the server from the rack (on page 28). Remove the access panel ("Access panel" on page 29). Loosen the rack bezel thumbscrews located inside the chassis. Remove the rack bezel.
  • Page 29: Access Panel

    After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place. WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack.
  • Page 30: Air Baffle

    To replace the component, reverse the removal procedure. Air baffle To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, if installed, remove the security bezel (on page 27). Power down the server (on page 26).
  • Page 31: Fan Blank

    Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: For tower models, place the server on a flat, level surface with the access panel facing up. For rack models, extend the server from the rack (on page 28).
  • Page 32: Fan

    Remove the fan blank. To replace the component, reverse the removal procedure. To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, if installed, remove the security bezel (on page 27). Power down the server (on page 26).
  • Page 33: Fan Cage

    When installing or replacing server components, one or more fans might need to be removed. To prevent an orderly or immediate server shutdown, HP highly recommends powering down the server during these procedures. To determine if powering down is required, see the specific procedure.
  • Page 34: Tower Feet

    Remove the fan cage. To replace the component, reverse the removal procedure. Tower feet NOTE: This procedure applies to tower servers only. To remove the component: Open and remove the bezel ("Remove the tower bezel" on page 27). Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
  • Page 35: Component Box Blank

    Place the server on the side. Remove the tower feet. To replace the component, reverse the removal procedure. Component box blank To remove the component: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, do the following: If installed, remove the security bezel (on page 27).
  • Page 36: Drive Blank

    Disconnect each power cord from the server Remove the access panel ("Access panel" on page 29). Remove the rack bezel. Remove the component box blank. To replace the component, reverse the removal procedure. Drive blank To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel"...
  • Page 37: Optical Drive Cage

    WARNING: To reduce the risk of injury from electric shock, do not remove more than one drive carrier at a time. To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel"...
  • Page 38: Optical Drive

    Using the T-15 screwdriver, loosen T-15 screws securing the optical drive cage. Remove the optical drive cage. To replace the component, reverse the removal procedure. Optical drive To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel"...
  • Page 39: Front I/O Assembly

    Disconnect each power cord from the server. For tower models, do the following: Place the server on a flat, level surface with the access panel facing up. Remove the access panel ("Access panel" on page 29). For rack models, do the following: Extend the server from the rack (on page 28).
  • Page 40: Power Supply Blank

    Remove the access panel ("Access panel" on page 29). For rack models, do the following: Extend the server from the rack (on page 28). Remove the access panel ("Access panel" on page 29). Release thumbscrews and remove the rack bezel. Remove the air baffle ("Air baffle"...
  • Page 41: Power Supply Module

    Power supply module CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel"...
  • Page 42 Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: For tower models, place the server on a flat, level surface with the access panel facing up. For rack models, extend the server from the rack (on page 28).
  • Page 43 Four-bay power supply configuration Loosen the two thumbscrews, and remove the power supply backplane from the cage: Two-bay power supply backplane board Removal and replacement procedures 43...
  • Page 44: Expansion Board

    Four-bay power supply backplane board To replace the component, reverse the removal procedure, if the screws are not attached to the backplane assembly, use the screws provided in the spare backplane assembly kit. Expansion board Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel"...
  • Page 45: Graphic Card Adapter

    Open the PCI retainer latch. Remove the expansion board. NOTE: If removing an expansion board from slots 3, 6 or 8, first release the retaining lever on the system board and then remove the card from the system. To replace the component, reverse the removal procedure. Graphic card adapter To remove the component: Do one of the following:...
  • Page 46 Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: For tower models, place the server on a flat, level surface with the access panel facing up. For rack models, extend the server from the rack (on page 28).
  • Page 47: Cache Module

    Disconnect the cables from the graphic card. Remove the graphic card. To replace the component, reverse the removal procedure. Cache module CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.
  • Page 48: Fbwc Capacitor Pack

    Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: For tower models, place the server on a flat, level surface with the access panel facing up. For rack models, extend the server from the rack (on page 28).
  • Page 49 CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server is powered down, wait for 30 seconds and then check the amber LED before disconnecting the cable from the cache module.
  • Page 50: Sff Drive Backplane

    SFF drive backplane To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, if installed, remove the security bezel (on page 27). Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
  • Page 51: Lff Drive Backplane

    Remove the SFF drive cage. Remove all drives from the drive cage ("Drive" on page 36). Loosen the thumbscrew on the drive backplane and remove it from the cage. To replace the component, reverse the removal procedure. LFF drive backplane To remove the component: Do one of the following: For tower models, open and remove the bezel...
  • Page 52 Disconnect each power cord from the power source. Disconnect each power cord from the server. For tower models, do the following: Place the server on a flat, level surface with the access panel facing up. Remove the access panel ("Access panel"...
  • Page 53: Systems Insight Display Assembly

    Remove all drives from the drive cage ("Drive" on page 36). Loosen the thumbscrew on the drive backplane and remove it from the cage. To replace the component, reverse the removal procedure. Systems Insight Display assembly CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
  • Page 54: Heatsink

    Remove the Systems Insight Display assembly. To replace the component, reverse the removal procedure. Heatsink To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, if installed, remove the security bezel (on page 27). Power down the server (on page 26).
  • Page 55 Open the heatsink retaining levers. Remove the heatsink. To replace the heatsink: Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing. Removal and replacement procedures 55...
  • Page 56 Remove the heatsink protective cover. Install the heatsink, and then close the heatsink retaining levers. Install the air baffle. Install the access panel. Do one of the following: For tower models, return the server to an upright position, and then install the bezel. For rack models, slide the server back into the rack.
  • Page 57: Heatsink Retaining Levers

    Heatsink Retaining Levers To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, if installed, remove the security bezel (on page 27). Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
  • Page 58: Processor

    Remove the heatsink. Remove the heatsink retaining levers. To replace the component, reverse the removal procedure. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.
  • Page 59 To remove the component: Do one of the following: For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). For rack models, if installed, remove the security bezel (on page 27). Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
  • Page 60 Remove the heatsink. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 60...
  • Page 61 Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. To install a processor: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor.
  • Page 62 CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
  • Page 63: Dimms

    Install the heatsink, and then close the heatsink retaining levers. Install the air baffle. Install the access panel. Do one of the following: For tower models, return the server to an upright position. For rack models, slide the server back into the rack. Connect each power cord to the server.
  • Page 64: System Board

    Disconnect each power cord from the server. Do one of the following: For tower models, place the server on a flat, level surface with the access panel facing up. For rack models, extend the server from the rack (on page 28). Remove the access panel ("Access panel"...
  • Page 65 Remove the air baffle ("Air baffle" on page 30). Remove the fan cage. Remove all DIMMs ("DIMMs" on page 63). Remove any installed PCI cards. Remove the PCI card support bracket on both sides. Disconnect all cables connected to the system board. Open the heatsink retaining levers.
  • Page 66 Remove the heatsink. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 66...
  • Page 67 Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. Always install the processor socket cover after removing the processor from the socket.
  • Page 68 To replace the system board: Install the spare system board. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 68...
  • Page 69 Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 70 CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket.
  • Page 71 Install the heatsink, and then close the heatsink retaining levers. Install the processor socket cover onto the processor socket of the failed system board. IMPORTANT: Install all components with the same configuration that was used on the failed system board. Install all components removed from the failed system board.
  • Page 72: System Battery

    Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. Press the Enter key to clear the warning. Enter the serial number and press the Enter key. Select Product ID.
  • Page 73: Hp Trusted Platform Module

    If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.
  • Page 74: Troubleshooting

    • Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc) The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...
  • Page 75: Diagnostic Tools

    Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.
  • Page 76: Hp Insight Remote Support Software

    HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s...
  • Page 77: Component Identification

    Component identification Front panel components • Item Description Media/Drive cage bay SAS/SATA drives (8) Serial number/iLO information pull tab* Optical drive USB connectors (4) *The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse side shows the default iLO account information.
  • Page 78: Front Panel Leds And Buttons

    • Item Description Media/Drive cage bay SAS/SATA drive (6) Serial number/iLO information pull tab* Optical drive USB connectors (4) *The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse side shows the default iLO account information. The same information is printed on a label attached to the chassis. Front panel LEDs and buttons Component identification 78...
  • Page 79: Rear Panel Components

    Item Description Status Power On/Standby button Solid green = System on and system power LED Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present* NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity...
  • Page 80: Rear Panel Leds

    Item Description PCIe slot 4 (Processor 1) UID button/LED Kensington security lock Serial connector iLO connector NIC connector 3 NIC connector 4 NIC connector 2 NIC connector 1 USB connectors (4) Video connector PCIe slot 5 (Processor 2) PCIe slot 6 (Processor 2) PCIe slot 7 (Processor 2) PCIe slot 8 (Processor 2) PCIe slot 9 (Processor 2)
  • Page 81: System Board Components

    Item Description Status Power supply LED Green = Normal Off = One or more of the following conditions exists: • Power is unavailable. • Power supply failed. • Power supply is in standby mode. • Power supply exceeded current limit. UID LED Blue = Activated Flashing blue = System is being managed remotely...
  • Page 82: System Maintenance Switch

    Item Description Internal USB tape connector Discovery service cable connector System battery SATA connectors Internal USB connector Processor 2 DIMM slots TPM connector System maintenance switch NMI header Slot 9 PCIe3 x8 (4, 1) Slot 8 PCIe3 x16 ( 16, 8, 4, 1) Slot 7 PCIe3 x8 (4, 1) Slot 6 PCIe3 x16 (16, 8, 4, 1) Slot 5 PCIe2 x8 (4, 1)
  • Page 83: Nmi Functionality

    Short the NMI header ("System board components" on page 81). For more information, see the HP website (http://www.hp.com/support/NMI). DIMM slots DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the letter assignments for population guidelines.
  • Page 84: Systems Insight Display Leds

    Systems Insight Display LEDs The HP Systems Insight Display LEDs represent the system board layout. Item Description Status Power cap To determine Power cap status, see "Systems Insight Display LED combinations (on page 84)." AMP Status Green = AMP mode enabled...
  • Page 85: Sas And Sata Device Numbers

    Systems Insight Display Health LED System power Status LED and color Amber One or more of the following conditions Processor (amber) might exist: • Processor in socket X has failed. • Processor X is not installed in the socket. • Processor X is unsupported.
  • Page 86 HP recommends that you populate drive bays starting with the lowest SAS or SATA device number. Drives are numbered from left to right in each component box. Component boxes are numbered 1 through 3, from bottom to top. • SFF drives •...
  • Page 87: Hot-Plug Drive Led Definitions

    Hot-plug drive LED definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity No drive activity Do not remove Solid white Do not remove the drive.
  • Page 88: Fbwc Module Leds (P222, P420, P420I, P421, P822)

    Item Description Configuration Fan 1 Redundant (primary fan when processor 2 is installed) Fan 2 Primary Fan 3 Primary Fan 4 Primary FBWC module LEDs (P222, P420, P420i, P421, P822) The FBWC module has three single-color LEDs (one amber and two green). The LEDs on the cache module installed on a storage controller are duplicated on the reverse side of the module to facilitate status viewing.
  • Page 89: Rps Riser Board Connectors

    1 - Amber 2 - Green 3 - Green Interpretation Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller. Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor pack is charging.
  • Page 90 Item Connector Description Drive backplane bay 1/optical drive power connector Drive backplane bay 2 power connector Drive backplane bay 3 power connector Graphic card power connector Component identification 90...
  • Page 91: Cabling

    Cabling Server data cabling Item Description Optical drive connector Drive cage 1, SAS connector 2 Drive cage 1, SAS connector 1 SATA connector SAS connector SAS connector Cabling 91...
  • Page 92: Media Device Data Cabling

    Media device data cabling Item Description Optical drive connector Optical drive connector Optical drive connector SATA connector SATA connector SATA connector Optical drive cabling Cabling 92...
  • Page 93: Specifications

    Specifications Environmental specifications Specification Value Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating Relative humidity (noncondensing) 10% to 90% Operating, maximum wet bulb temperature of 28°C (82.4°F) 5% to 95% Nonoperating, maximum wet bulb temperature of 38.7°C (101.7°F) * All temperature ratings shown are for sea level.
  • Page 94: Hp 460 W Gold Power Supply (92% Efficiency)

    • HP 460 W Gold Power Supply (92% efficiency) • HP 460 W Platinum Plus Power Supply (94% efficiency) • HP 750 W Gold Power Supply (92% efficiency) • HP 750 W Platinum Plus Power Supply (94% efficiency) • HP 1200 W Platinum Plus Power Supply (94% efficiency)
  • Page 95: Hp 750 W Gold Power Supply (92% Efficiency)

    750 W at 200V to 240V AC input 750 W at 100V to 120V AC input Maximum peak power 750 W at 200V to 240V AC input HP 750 W Platinum Plus Power Supply (94% efficiency) Specification Value — Input requirements...
  • Page 96 10 A at 100 VAC Rated input current 6.7 A at 200 VAC 990 W at 115V AC input Rated input power 1315 W at 230V AC input 3060 at 100V AC input Btus per hour 3380 at 115V AC input 4503 at 200V AC input 4485 at 230V AC input —...
  • Page 97: Acronyms And Abbreviations

    Acronyms and abbreviations Advanced Memory Protection CS HE HP Common Slot High-Efficiency (power supply) Customer Self Repair FBWC flash-backed write cache Integrated Lights-Out Integrated Management Log large form factor LRDIMM load reduced dual in-line memory module nonmaskable interrupt NVRAM nonvolatile memory...
  • Page 98 POST Power-On Self Test HP ProLiant Support Pack RBSU ROM-Based Setup Utility redundant power supply serial attached SCSI SATA serial ATA small form factor Systems Insight Display Systems Insight Manager Trusted Platform Module unit identification universal serial bus Acronyms and abbreviations 98...
  • Page 99: Documentation Feedback

    Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
  • Page 100: Index

    57 connectors 77 HP iLO 77 crash dump analysis 83 HP Insight Diagnostics 75 HP Insight Diagnostics survey functionality 75 HP Insight Remote Support software 76 data cabling 91 device bay blank 35 device numbers 85 identifying components 77...
  • Page 101 optical drive cage 37 utilities 75 PCI air baffle 30 warnings 25 POST error messages 74 power LEDs, system 78 power supply blank 40 power supply specifications 93, 94, 95 powering down 26 powering up 26 problem diagnosis 74 processors 58 rack bezel 26, 27 rear panel components 79 rear panel LEDs 80...

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