Instruction - Siemens SXG 75 Service Repair Documentation

1 Instruction

This Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3.
The described failures shall be repaired in BenQ Mobile authorized local workshops only.
All repairs has to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations has to be considered.
Assembling/disassembling has to be done according to the latest SXG75 Level 2 repair
documentation. It has to be ensured that each repaired mobile phone is checked according to the
latest released General Test Instruction document (both documents are available in the technical
support section of the C-market).
Check at least weekly C-market for updates and consider all SXG75 related Customer Care
Information and Repair Information which are relevant for the SXG75.
SXG75 partnumber on IMEI label:
, while # can be any letter (A-Z) and xxx can be any number from 100, 101, 102....
Scrap handling: All scrap informations given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules
(available in the communication market) and avoid excessive heat.
If you do have any questions regarding the repair procedures or spare parts do not hesitate to
contact our technical support team in Kamp-Lintfort, Germany:
Tel.: +49 2842 95 4666
Fax: +49 2842 95 4302
e-mail: st-support@benq.com
Technical Documentation
TD_Repair_L3_SXG75_R1.0.pdf
S30880-S8900-#xxx
Company Confidential
2006©BenQ
Release 1.0
01/2006
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