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HCD-TZ100/TZ200/TZ300
Ver. 1.1
AAC (USB device only)
File Extension:
m4a
Bitrate:
48 kbps - 320 kbps
Sampling frequencies:
44.1 kHz
DivX
File Extension:
avi/divx
Video codec:
DivX video
Bitrate:
8 Mbps (MAX)
Frame rate:
30 fps
720 × 576
Resolution:
Audio codec:
MP3
MPEG4
File format:
MP4 File Format
File Extension:
mp4/m4v
Video codec:
MPEG4 Simple Profi le
(AVC is not compatible.)
Bitrate:
4 Mbps
Frame rate:
30 fps
720 × 576
Resolution:
Audio codec:
AAC-LC (HE-AAC is not
compatible.)
DRM:
Not compatible
Design and specifi cations are subject to change
without notice.
MODEL IDENTIFICATION
– Back Panel –
Model
TZ200: E12 model
TZ200: E3, SAF model
TZ200: SP model
TZ200: PH model
TZ200: TH model
TZ200: E32 model
TZ200: MX model
TZ200: AUS model
TZ200: EA model
TZ300: MX model
TZ100: MX model
TZ200: AR model
• Abbreviation
AR
: Argentina model
AUS
: Australian model
E3
: 240V AC area in E model
E12
: 220 – 240V AC area in E model
E32
: 110 – 240V AC area in E model
EA
: Saudi Arabia model
MX
: Mexican model
PH
: Philippines model
SAF
: South African model
SP
: Singapore model
TH
: Thai model
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
Parts No.
Part No.
4-121-420-0[]
4-121-420-1[]
4-121-420-2[]
4-121-420-3[]
4-121-420-4[]
4-121-420-5[]
4-121-420-7[]
4-121-420-8[]
4-121-420-9[]
4-121-421-2[]
4-121-421-4[]
4-121-421-6[]
WITH
SONY
PARTS
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
NOTES ON CHIP COMPONENT REPLACEMENT
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
Keep the temperature of soldering iron around 270 °C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SPECIAL COMPONENT NOTICE
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
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