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MIC AND SENS CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<08>MIC
LYB20039-001A
FOIL SIDE(B)
4
R201
TL201
<07>SENS
LYB20039-001A
FOIL SIDE(B)
CN201
1
D201
C201
IC101
C171
C172
R171
R124
Q122
COMPONENT SIDE(A)
TL201
COMPONENT SIDE(A)
IC101
R121
R123
R122
(No.YF183)2-41
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