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CCD,OPE,MONITOR AND BATT TERMINALCIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB20038-001B
FOIL SIDE(B)
39
1
CN4201
38
2
GEL3_1
GEL2_4
GEL2_3
D5201
D5202
3
1
C5201
GEL2_2
GEL2_1
IC4202
C4223
C5203
C5202
C5209
4
5
C4202
GEL1_4
GEL1_3
C4225
L4211
L4208
C4226
L4210
L4209
IC4201
C4221
R4208
R4223
R4210
GEL1_2
GEL1_1
R4202
TL4202
TL4201
R4201
C4209
R4224
R4203
<04>OPE
LYB10089-001A
COMPONENT SIDE(A)
COMPONENT SIDE(A)
C5206
R5227
C5208
L4206
Q5202
R5224
R5230
R5225
R5228
D4201
L4201
C5207
C4203
R5226
C4205
C4201
C4206
C4204
L4203
L4207
CN402
FOIL SIDE(B)
S402
(No.YF183)2-39
<05>MONITOR
LYB10089-001A
COMPONENT SIDE(A)
S7501
3
1
2
IC7601
IC7602
2
1
3
C7624
TL7607
C7625
TL7608
TL7609
C7626
C7627
TL7602
TL7604
TL7601
TL7606
TL7605
R7605
Q7601
R7606
<06>BATT TERMINAL
LYB10089-001A
COMPONENT SIDE(A)
BT651
2-40(No.YF183)
FOIL SIDE(B)
C7602
5
4
C7601
L7602
C7615
L7603
IC7603
C7614
1
3
R7611
R7608
R7603
C7623
R7613
R7610
C7616
R7602
R7612
R7609
TL7603
CN7602
FOIL SIDE(B)
D651
1
CN651
6
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