Table of Contents
Advertisement
Parts Layout on Disk Motor Circuit Board
7-4-4. Parts Layout on Disk Motor Circuit Board
LOT. NO
-89-
Electric Parts
7·5. ELECTRIC PARTS
7-5·1. Chip Parts Replacement Procedure
This unit uses chip compone.lts such as carbon
resistor, ceramic capacitor, transistor and diode in
some circuits. It also uses IC's of flat-pack type.
As the appearance of carbon resistor and ceramic
capacitor are identical, destinguishment of each can
be possible by visual check of reference address of
silk-screen print on the printed circuit board.
As the shape of transistor and diode are same, they
also are distinguished by the reference address of silk-
screen print.
Tools:
• Soldering iron; 20 W
(If
possible, use soldering tip with heat-con-
troller of 270 ± 10°C)
• Desoldering metal braid ("SOLDER TAUL" or
equivalent)
• Solder (of 0.6 mm dia. is recommended.)
• Tweezers
Soldering Conditions:
Tip temperature; 270± 10°C
Solder within 2sec. per an electrode
Higher temperature or longer tip application than
specified may be damaged to the chip Gomponent.
(I) Resistor and Capacitor
1)
Add heat onto the chip-part by the top of solder-
ing iron tip and slide the chip-part aside when the
solder is melted.
2) Confirm visually with care that there is no pattern
peeling, damage, and/or bridge where the part was
removed or its surrounding.
3) Presolder the pattern into thin where the part was
removed.
4)
Place a new chip-part onto the pattern and solder
both sides.
CAUTION:
Do
not use
the chip-part again
once used.
(2) Transistor and Diode
1)
Cut the leads of the semiconductor part to be
removed with a cutter.
2) Remove the leads cut as the above, and confirm
visually that there is no pattern peeling, any
damage and/or bridge where the part was removed
or its surrounding.
3)
Presolder the pattern into thin where the part was
removed.
4)
Place a new chip-part onto the pattern and solder
the leads.
(3) IC (Flat-pack type)
1)
Cut the leads of the IC to be removed with a
cutter.
2) Remove the each pin of IC from the pattern by
tweezers while heating the pin by soldering iron.
3)
Confirm visually with care that there is no pattern
peeling, damage, and/or bridge where the part was
removed or its surrounding.
4) Place
a
new IC onto the pattern and solder it.
5) Confirm by tester that each conduction between
IC's terminal and upper port is surely made.
6) If not, resolder the portion.
Cutter
-90-
Advertisement
Table of Contents
