4-4.
4-5.
Thermal Head Section ............................................................................... 4-14
5-1.
Print is Faulty .............................................................................................. 5-1
5-2.
5-3.
5-4.
5-5.
5-6.
6-1
6-2.
6-3.
Feed Operation ............................................................................................ 6-2
6-4.
7. Semiconductor Pin Assignments
2
4-4-1.
Reading of Keys ......................................................................... 4-8
4-4-2.
4-4-3.
4-4-4.
4-4-5.
4-4-6.
4-4-7.
4-4-8.
4-4-9.
4-5-1.
Structure ................................................................................... 4-14
4-5-2.
Basic Operation ........................................................................ 4-15
4-5-3.
Stair Generation ....................................................................... 4-15
4-5-4.
4-5-5.
UP-895/(E)