IBM ThinkPad R30 Hardware Maintenance Manual page 147

No. Description
Lower Case w/ label Taiwan
Lower Case w/ label India
Lower Case w/ label India 2656
Lower Case w/ label W/W 2657
Lower Case w/ label EMEA 2657
Lower Case w/ label IIPC 2657
Lower Case w/ label Korea 2657
Lower Case w/ label Taiwan 2657
Lower Case w/ label India 2657
Lower Case w/ label W/W 2676
Lower Case w/ label EMEA 2676
Lower Case w/ label IIPC 2676
Lower Case w/ label Korea 2676
Lower Case w/ label Taiwan 2676
Lower Case w/ label India 2676
Lower Case w/ label WW-wireless
Lower Case w/ label EMEA-wireless
Lower Case w/ label IIPC-wireless
Lower Case w/ label Korea-wireless
Lower Case w/ label Taiwan-wireless
17 SoDIMM Asm. –128MB
SoDIMM Asm.—256MB
18 Actiontec IEEE 802.11b/Modem combo
card-WinXP
19 Mini-PCI / DIMM door kit
20 Battery Assy. (Ni-Mh)
Sanyo-W/W
Sanyo-Japan
Battery Assy. (Li-Ion)
Sanyo-W/W
Sanyo-Japan
Panasonic-W/W
Panasonic-Japan
21 Speaker Kit
22 RTC Battery
23 CD-ROM Module
TEAC
HLDS(LG)
MT 2656, 2657, 2676
FRU No.
12P4327
46L6371
12P4333
12P4334
12P4335
12P4336
12P4337
12P4338
12P4339
12P4340
12P4341
12P4342
12P4343
12P4344
12P4345
12P4328
12P4329
12P4330
12P4331
12P4332
19K4653*
19K4655*
12P3637
46L6335*
02K6827*
02K6835*
02K6822*
02K6830*
02K6824*
02K6832*
02K5989
02K7062
27L3436*
27L4301*
141