SCHEMATIC DIAGRAMS
COMPACT COMPONENT SYSTEM
SP-HXC6
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
Contents
HX-C6
CD-ROM No.SML200506
CA-HXC6
COPYRIGHT
2005 Victor Company of Japan, Limited.
Area suffix
J ---------------------------- U.S.A.
SP-HXC6
2-1
2-2
2-3
2-7 to 10
2005/6