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3
Features
3.1
Overview
This section provides an overview of the key characteristics for the baseboard
D3144, the CPU Memory Risers (CPUMEMRs) D3145, and the PCI Riser
(PCIR) D3146.
Processors
Up to 8 Intel Xeon® E7-8xxx series (Westmere-EX) processors (up to
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130 W); one processor per CPUMEMR
4 Intel QuickPath Interconnects; up to 6,4 GT/s in each direction
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Hyper-Threading technology with up to 20 threads/CPU (2 threads/core,
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10 cores/CPU)
Up to 2.0 MB L2 cache and 30 MB L3 cache (Westmere-EX)
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Supports x2APIC
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Main memory
Up to 128 slots for DDR3 memory modules (1333 MHz) with 2 GB, 4 GB,
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8 GB, 16 GB and 32 GB capacity; 16 slots per CPUMEMR
4 SMI links per CPU and up to 4 DDR3 DIMM memory modules per SMI link;
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memory modules connected to CPU via memory buffer named Millbrook2;
Intel® Scalable Memory Interconnect (SMI) link connects CPU and
Millbrook2
Maximum configuration: 4 TB memory with availability of 32 GB memory
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modules
Basic configuration: 32 GB memory; 4 CPUMEMRs with 4 memory modules
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per CPUMEMR
Maximum 32 Gbit/s band width (DDR3)
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Supports +1.5 V and +1.35 V memory modules
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Hardware memory scrubbing
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Single Device Data Correction (SDDC) function (Chipkill™)
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D3144, D3145, D3146 (RX900 S2)
Technical Manual
15
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