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NOTE:
The following illustration shows the fan/heat sink assembly removal process on a computer
model equipped with an Intel processor, the Intel HM45 chipset, and a graphics subsystem with
UMA memory.
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, fan/heat sink assembly, processor, and system board spare part kits.
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor.
Component replacement procedures
83
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