I/O Voltage Rails; Mb Ddr3 Component Memory - Xilinx SP605 User Manual

I/O Voltage Rails

There are four available banks on the XC6SLX45T-3FGG484 device. Banks 0, 1, and 2 are
connected for 2.5V I/O. Bank 3 is used for the 1.5V DDR3 component memory interface of
Spartan-6 FPGA's hard memory controller. The voltage applied to the FPGA I/O banks
used by the SP605 board is summarized in
Table 1-2: I/O Voltage Rail of FPGA Banks
References
See the Xilinx Spartan-6 FPGA documentation for more information at
http://www.xilinx.com/support/documentation/spartan-6.htm.

2. 128 MB DDR3 Component Memory

There are 128 MB of DDR3 memory available on the SP605 board. A 1-Gb Micron
MT41J64M16LA-187E (96-ball) DDR3 memory component is accessible through Bank 3 of
the LX45T device. The Spartan-6 FPGA hard memory controller is used for data transfer
across the DDR3 memory interface's 16-bit data path using SSTL15 signaling. The
maximum data rate supported is 800 Mb/s with a memory clock running at 400 MHz.
Signal integrity is maintained through DDR3 resistor terminations and memory on-die
terminations (ODT), as shown in
Table 1-3: Termination Resistor Requirements
Notes:
1.
SP605 Hardware User Guide
UG526 (v1.1.1) February 1, 2010
FPGA Bank
0
1
2
3
Signal Name
MEM1_A[14:0]
MEM1_BA[2:0]
MEM1_RAS_N
MEM1_CAS_N
MEM1_WE_N
MEM1_CS_N
MEM1_CKE
MEM1_ODT
MEM1_DQ[15:0]
MEM1_UDQS[P,N], MEM1_LDQS[P,N]
MEM1_UDM, MEM1_LDM
MEM1_CK[P,N]
Nominal value of V for DDR3 interface is 0.75V.
TT
www.xilinx.com
Table 1-2.
I/O Voltage Rail
2.5V
2.5V
2.5V
1.5V
Table 1-3 and Table 1-4.
Board Termination
49.9 ohms to V
49.9 ohms to V
49.9 ohms to V
49.9 ohms to V
49.9 ohms to V
100 ohms to GND
4.7K ohms to GND
4.7K ohms to GND
100 ohm differential at
memory component
Detailed Description
On-Die Termination
–
TT
–
TT
–
TT
–
TT
–
TT
–
–
–
– ODT
– ODT
– ODT
–
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