Related Manuals for Citizen CBM-202LA
Summary of Contents for Citizen CBM-202LA
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Page 1: Specifications
CONTROL IC FOR LINE THERMAL PRINTER (FOR LT SERIES) SPECIFICATIONS MODEL CBM-202LA GATE ARRAY Updated on Oct. 25, 1996 Japan CBM Corporation Information Systems Div. -
Page 2: Table Of Contents
CONTENTS 1 OUTLINE.................................3 2 GENERAL SPECIFICATIONS ..........................4 2.1 SHAPE AND DIMENSIONS ............................... 4 2.2 STRUCTURE..................................4 2.3 OPERATING VOLTAGE ..............................4 2.4 OPERATING FREQUENCY ............................... 4 2.5 ENVIRONMENTAL SPECIFICATIONS ..........................4 2.6 APPLICABLE MODELS ..............................4 3 OUTLINE OF CIRCUITS............................5 3.1 THERMAL HYSTERESIS CONTROL.......................... -
Page 3: Outline
OUTLINE In order to assure proper operation, be sure to use this Gate Array following the contents of this specifications. Absolutely, do not carry out anything other than specified in this specifications. This Gate Array has the following specifications. With thermal hysteresis control function being added, high quality printing is made available. With strobe split control function being added, printing is performed in small current. -
Page 4: General Specifications
GENERAL SPECIFICATIONS SHAPE AND DIMENSIONS 100-pin plastic QFP package 23.6 17.6 2.7 (mm) (See Section 6. PACKAGE SPECIFICATION.) STRUCTURE C-MOS LSI OPERATING VOLTAGE 10% DC OPERATING FREQUENCY 16MHz ENVIRONMENTAL SPECIFICATIONS Temperature Operating temperature - 40ºC + 85ºC Storage temperature - 65ºC + 150 ºC APPLICABLE MODELS LT280, LT380 series... -
Page 5: Outline Of Circuits
OUTLINE OF CIRCUITS THERMAL HYSTERESIS CONTROL When Line Thermal Head performs printing at high speed, heat remaining from printing which is one dot line before may give some influence, resulting in blurred prints or trailing. This gate array, therefore, can serve to control printing to the best result through monitoring state of operation of the preceding stage. -
Page 6: Detailed Specifications Of Hardware
DETAILED SPECIFICATIONS OF HARDWARE ABSOLUTE MAXIMUM RATINGS ITEM SYMBOL CONDITIONS RATINGS UNIT Supply Voltage -0.5 to +6.5 I/O Voltage Vi/ Vo -0.5 to Vdd+0.5 Output Current Output current 9mA type Output Current Output current 13.5mA type Operating Temperature Topt -40 to +85 ºC Storage Temperature Tstg... - Page 7 SWITCHING CHARACTERISTICS (Unless otherwise specified, Vdd=5V 10%, Ta=-40 +85 ºC) ITEM SYMBOL CONDITION TYP. UNIT Toggle Frequency ftog Internal togle F/F (F/O=2) Internal gate F/O=1, Wiring length 0mm 0.27 F/O=2, Wiring length 2mm 0.50 Transfer Delay Time Internal gate (power gate) F/O= 2, Wiring length 2mm 0.40 Input buffer...
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Page 8: Terminals And Their Functions
TERMINALS AND THEIR FUNCTIONS SIGNAL PIN CHARACTERISTIC FUNCTION NAME DIRECTION RAMOE Output CMOS9mA type with pull-up OE/RFSH pin of PS-RAM Output CMOS9mA type with pull-up DMA request Output CMOS9mA type Head voltage control HRCHK Output CMOS9mA type Changeover of Head cut-off detect voltage HODATA Input CMOS type with pull-up... - Page 9 SIGNAL PIN CHARACTERISTIC FUNCTION NAME DIRECTION PC15 Input CMOS type with pull-up Preset & Centro-data input PC14 Input CMOS type with pull-up Preset & Centro-data input PC13 Input CMOS type with pull-up Preset & Centro-data input PC12 Input CMOS type with pull-up Preset &...
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Page 10: Power Terminal
SIGNAL PIN CHARACTERISTIC FUNCTION NAME DIRECTION Input CMOS type with pull-up Address bus input CLK16M Input CMOS type with pull-up 16MHz clock input Input CMOS type with pull-up Reset input RES0 Input CMOS type with pull-up Reset input (watchdog) Input CMOS type with pull-up ROM chip select Input... -
Page 11: Internal Address Map
INTERNAL ADDRESS MAP CS1 OPERATION AND APPLICABLE PORT Prohibited Print data buffer Prohibited DMA request PAI port input PA0 port output & address latch output PBI port input Prohibited PCI port input & Centro-data input PC0 port output (PBUSY) 180° turning output Bit data buffer for processing Double width lower 8-bit output Double width upper 8-bit output... -
Page 12: Print Data Transfer Method
PRINT DATA TRANSFER METHOD When printing is performed with Line Thermal Head at high speed, it is necessary for you either to control printing speed so that heat from printing of the preceding stage does not give any influence or to perform stored heat correction so that remaining heat is eliminated. - Page 13 Data transfer sequence is shown as follows: The following procedures are needed for printing operation: Turning on HVC port pin, supply Vp voltage to Head. Supply Vm voltage to the paper feed motor of Printer Mechanism and enter Start Hold. While in Start Hold, transfer, to Head, print data of the 1st dot line.
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Page 14: Reset Circuit
The whole sequence is shown as follows: RESET CIRCUIT With RES pin (No 94 pin) set to "Low" level, STB 1 3 (No's 9 11 pins) are made in high impedance state cutting off current supply to Thermal Head. Perform pull-up or pull-down according to Thermal Head. Further, with a watchdog timer output (CPU, etc.) connected to RESO pin (No 95 pin), checking is performed on every ROM access time, thus protecting Thermal Head. -
Page 15: System Clock Circuit
SYSTEM CLOCK CIRCUIT In order to acquire speed to transfer data to Head, input 16MHz clock in CLK16M pin (Pin 93.) Divide this clock internally into four to create 4MHz, which is used as the basic clock for data transfer. As this clock serves as the basic clock for data transfer, clock frequency which can assure enough pre-pulse /main pulse data transfer for the printing period is needed. -
Page 16: Parallel Input Circuit
4.12 PARALLEL INPUT CIRCUIT This port is used as being shared by PCI (0 7), 8-bit parallel general purpose input. STB input, ACK output and BUSY output are used as independent ports. When STB input is made "low", PCI port data are latched. Also, at the same time, BUSY output is made "high". With STB input returned to "high", INTR pin gets "low"... -
Page 17: General Purpose I/O Output Circuit
UNIT 4.14 GENERAL PURPOSE I/O OUTPUT CIRCUIT Besides the PAO ports and PCI ports mentioned above, there are some other ports available. PORT NAME INCIDENTAL CONDITIONS ADDRESS Output ASTB pin at "Low". XX02h Output Bit 7 held at PBUSY. Others are unused. XX04h Input None XX02h... - Page 18 c) 90° Turning Circuit 1. Write, in the 90° turning data buffer which extends from Address XX08h to XX0Fh, the data to be turned. 2. In the same way, with XX08h XX0Fh being read, data which have been turned by 90° can be obtained. This is highly convenient as both rightward and leftward turning is freely available by the writing and reading order.
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Page 19: Pseudo-Sram Connecting Method
4.16 PSEUDO-SRAM CONNECTING METHOD In the system consisted of the CPU and gate array, S-RAM may be used as the work area as the print data buffer, bit data development, etc.. This gate array supports Self-Refresh so that a pseudo-SRAM can be easily connected. Use the PS-RAM which integrates OE and RFSH pins into one. -
Page 20: Operation Timing
OPERATION TIMING Operation timings immediately following initialization are shown below:... -
Page 21: Package Specification
PACKAGE SPECIFICATION SHAPE AND DIMENSIONS OUTLINE DRAWING Material Main body: epoxy type resin / satin finish for marking face Lead: iron/ nickel alloy/ solder plating... -
Page 22: Mount Pad Dimensions
MOUNT PAD DIMENSIONS UNIT: mm NO OF PINS PER SIDE PIN PITCH PAD WIDTH PAD LENGTH FITTING WIDTH 0.65 0.35 14.6 20.6... -
Page 23: Referential Circuit Diagram
REFERENTIAL CIRCUIT DIAGRAM... -
Page 25: Remarks For Mounting
REMARKS FOR MOUNTING TEMPERATURE CONDITIONS FOR MOUNTING Infrared Reflow System Recommended Conditions Peak temperature : 230ºC and less (package surface temp.) Time : Within 30 seconds (at 210ºC or above) No of times Flux : Rosin type flux with less chlorine content(chlorine 0.2Wt% or less) VPS Reflow System Recommended Conditions Peak temperature : 215ºC and less (boiling temp. -
Page 26: Storage Conditions
STORAGE CONDITIONS Resin material of the plastic mold package absorbs moisture when exposed in a room. If the package being mounted with moisture absorbed, therefore, it may adversely influence Device reliability (especially in its moisture resistance). The products, therefore, are shipped in dry-pack for which aluminum laminated bags with desiccant placed inside. For storage prior to mounting, pay attention to the following: 1. -
Page 27: Packing Specifications
PACKING SPECIFICATIONS Unit mm Heat resistant conductive plastic Applicable Package No Per Packing 100-pin plastic QFP... - Page 28 1. Item Packaging Container 2. Item Packaging Box Label position Top or side face of box Label content Product name, amount, lot No, stanards/category ITEM PACKAGING CONTAINER ITEM PACKAGING BOX APPLICABLE NAME OF TRAY MAX.NO DIMENSIONS MAX.NO PACKAGE /TRAY /BOX (mm) (W H L) LA-244A (heat resistant, lead holder)