Thermal Considerations For Components - Intel DH67CF Specification

Table 33 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 33. Thermal Considerations for Components
Component
Processor
Intel H67 Express Chipset
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 34. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 34. Tcontrol Values for Components
Component
Processor
Intel H67 Express Chipset
For information about
Processor datasheets and specification updates
Intel H67 Express Chipset
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
104 o C
Tcontrol
For processor case temperature, see processor datasheets and
processor specification updates
o
107 C
Technical Reference
Refer to
Section 1.3, page 16
http://www.intel.com/products/desktop/
chipsets/
59