Thermal Considerations For Components - Intel BOXDQ67EPB3 Specification

Figure 16 shows the locations of the localized high temperature zones.
Figure 16. Localized High Temperature Zones
Table 29 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components
Component
Processor
Intel Q67 Express Chipset
For information about
Processor datasheets and specification updates
Item Description
A Processor voltage regulator area
B Processor
C Intel Q67 Express Chipset
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
111 C (under bias)
Technical Reference
Refer to
Section 1.3, page 14
61