Thermal Considerations; Processor Heatsink Airflow - Intel BOXD915GVWBL - Desktop Board D915GVWBL Manual

Desktop board technical product specification
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Intel Desktop Board D915GVWB Technical Product Specification

2.12 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38
requirement. Use a processor heatsink that provides omni-directional airflow (as shown in
Figure 23) to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.14.
60
Figure 23. Processor Heatsink Airflow
o
C at the processor fan inlet is a
OM16996

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