Audio Subsystem; Audio Subsystem Software; Audio Connectors; 8-Channel (7.1) Audio Subsystem - Intel BLKD945GTPL Technical Product Specification

Intel Desktop Board D945GTP Technical Product Specification

1.9 Audio Subsystem

The board supports the Intel High Definition audio subsystem based on the Sigmatel 9223 or the
Sigmatel 9220 audio codec. The audio subsystem supports the following features:
•
Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize
the device that is connected to an audio port. The back panel audio jacks are capable of
retasking according to user's definition, or can be automatically switched depending on the
recognized device type.
•
Stereo input and output for all back panel jacks
•
Line out and Mic in functions for front panel audio jacks
•
A signal-to-noise (S/N) ratio of 95 dB

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel's World Wide Web site.
For information about
Obtaining audio software and drivers

1.9.2 Audio Connectors

The board contains audio connectors on both the back panel and the component side of the board.
The front panel audio connector provides mic in and line out signals for the front panel. The
functions of the back panel audio connectors are dependent on which subsystem is present. The
8-channel (7.1) audio subsystem is described in Section 1.9.3; the 6-channel (5.1) audio subsystem
is described in Section 1.9.4.
For information about
The location of the front panel audio connector
The signal names of the front panel audio connector
The back panel audio connectors

1.9.3 8-Channel (7.1) Audio Subsystem

The 8-channel (7.1) audio subsystem includes the following:
•
Intel 82801G I/O Controller Hub (ICH7)
•
Sigmatel 9223 audio codec
•
Microphone input that supports a single dynamic, condenser, or electret microphone
The back panel audio connectors are configurable through the audio device drivers. The available
configurable audio ports are shown in Figure 9.
28
Refer to
Section 1.2, page 15
Refer to
Figure 20, page 56
Table 19, page 58
Section 2.8.1, page 53