IBM THINKPAD T60 Hardware Maintenance Manual page 121

Following components soldered on the top side of the system board are extremely
sensitive. When you service the system board, avoid any kind of rough handling.
a
Accelerometer chip for the HDD Active Protection System
b
Security chip
c
CPU
d
Video chip
e
MCH (Memory Controller Hub)
f
ICH (I/O Controller Hub)
Bending or flexing the system board can cause ball grid array (BGA) connections
to crack (unzip).
Removing and replacing a FRU
c
d
f
e
b a
ThinkPad T60 and T60p (14.1-inch and 15.0-inch)
115