Intel EM64T - Celeron D 336 Boxed Ena User Manual page 4

4.2.4
4.2.5
4.2.6
4.2.7
4.2.8
®
5 Intel Thermal/Mechanical Reference Design Information............................................... 39
5.1 Intel Validation Criteria for the Reference Design................................................ 39
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.2 Environmental Reliability Testing ......................................................................... 42
5.2.1
5.2.2
5.2.3
5.3 Material and Recycling Requirements ................................................................. 44
5.4 Safety Requirements............................................................................................ 45
5.5 Geometric Envelope for ATX Intel
5.6 ATX Reference Thermal Mechanical Solution for the Intel
in the 775-Land LGA Package ............................................................................ 46
5.7 Reference Attach Mechanism .............................................................................. 48
5.7.1
5.7.2
6 Acoustic Fan Speed Control ............................................................................................. 53
6.1 Acoustic Fan Speed Control................................................................................. 53
6.2 Thermal Solution Design ...................................................................................... 53
6.2.1
6.2.2
6.2.3
6.3 Board and System Implementation ...................................................................... 55
6.3.1
6.4 Combining Thermistor and Thermal Diode Control ............................................. 59
6.5 Interaction of Thermal Profile and T
Appendix A LGA775 Socket Heatsink Loading .................................................................................... 61
A.1 LGA775 Socket Heatsink Considerations ............................................................ 61
A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel
Reference Design................................................................................................. 61
A.2.1
4
On-Demand Mode ................................................................................ 34
System Considerations......................................................................... 34
Operating System and Application Software Considerations............... 35
On-Die Thermal Diode.......................................................................... 35
4.2.7.1 Reading the On-Die Thermal Diode Interface..................... 35
4.2.7.2 Correction Factors for the On-Die Thermal Diode .............. 36
THERMTRIP# Signal ............................................................................ 37
4.2.8.1 Cooling System Failure Warning......................................... 37
Heatsink Performance Target............................................................... 39
Acoustics............................................................................................... 40
Altitude .................................................................................................. 40
Reference Heatsink Thermal Validation ............................................... 41
Fan Performance for Active Heatsink Thermal Solution ...................... 41
Structural Reliability Testing ................................................................. 42
5.2.1.1 Random Vibration Test Procedure...................................... 42
5.2.1.2 Shock Test Procedure......................................................... 42
5.2.1.2.1 Recommended Test Sequence........................... 43
5.2.1.2.2 Post-Test Pass Criteria ....................................... 43
Power Cycling ....................................................................................... 44
Recommended BIOS/Processor/Memory Test Procedures................. 44
®
Structural Design Strategy.................................................................... 48
Mechanical Interface to the Reference Attach Mechanism .................. 49
Compliance to Thermal Profile ............................................................. 53
Determine Thermistor Set Points.......................................................... 53
Minimum Fan Speed Set Point ............................................................. 54
Choosing Fan Speed Control Settings ................................................. 55
6.3.1.1 Temperature to begin Fan Acceleration.............................. 56
6.3.1.2 Minimum PWM Duty Cycle.................................................. 58
Heatsink Preload Requirement Limitations .......................................... 61
Reference Thermal Mechanical Design ...... 45
®
Pentium
......................................................... 59
CONTROL
Thermal/Mechanical Design Guide
R
®
4 Processor