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640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU Manuals
Manuals and User Guides for Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU. We have
1
Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU manual available for free PDF download: User Manual
Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU User Manual (105 pages)
User Guide
Brand:
Intel
| Category:
Computer Hardware
| Size: 5.42 MB
Table of Contents
Table of Contents
3
Revision History
8
1 Introduction
9
Document Goals and Scope
9
Importance of Thermal Management
9
Document Goals
9
Document Scope
10
References
11
Definition of Terms
12
2 Processor Thermal/Mechanical Information
15
Mechanical Requirements
15
Processor Package
15
Figure 1. Package IHS Load Areas
15
Heatsink Attach
17
General Guidelines
17
Heatsink Clip Load Requirement
17
Additional Guidelines
18
Thermal Requirements
18
Processor Case Temperature
18
Thermal Profile
19
Figure 2. Processor Case Temperature Measurement Location
19
Tcontrol
20
Figure 3. Example Thermal Profile
20
Heatsink Design Considerations
21
Heatsink Size
22
Heatsink Mass
22
Package IHS Flatness
22
Thermal Interface Material
23
System Thermal Solution Considerations
23
Chassis Thermal Design Capabilities
23
Improving Chassis Thermal Performance
23
Summary
24
System Integration Considerations
24
3 Thermal Metrology
25
Characterizing Cooling Performance Requirements
25
Example
26
Figure 4. Processor Thermal Characterization Parameter Relationships
26
Processor Thermal Solution Performance Assessment
27
Local Ambient Temperature Measurement Guidelines
27
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink
29
Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink
29
Processor Case Temperature Measurement Guidelines
30
4 Thermal Management Logic and Thermal Monitor Feature
31
Processor Power Dissipation
31
Thermal Monitor Implementation
31
PROCHOT# Signal
32
Thermal Control Circuit
32
Operation and Configuration
33
Figure 7. Concept for Clocks under Thermal Monitor Control
33
On-Demand Mode
34
System Considerations
34
Operating System and Application Software Considerations
35
On-Die Thermal Diode
35
Reading the On-Die Thermal Diode Interface
35
Table 1. Thermal Diode Interface
35
Correction Factors for the On-Die Thermal Diode
36
THERMTRIP# Signal
37
Cooling System Failure Warning
37
5 Intel ® Thermal/Mechanical Reference Design Information
39
Intel Validation Criteria for the Reference Design
39
Heatsink Performance Target
39
Table 2. ATX Reference Heatsink Performance Target
39
Acoustics
40
Altitude
40
Reference Heatsink Thermal Validation
41
Fan Performance for Active Heatsink Thermal Solution
41
Table 3. Fan Electrical Performance Requirements
41
Environmental Reliability Testing
42
Structural Reliability Testing
42
Figure 8. Random Vibration PSD
42
Random Vibration Test Procedure
42
Shock Test Procedure
42
Figure 9. Shock Acceleration Curve
43
Post-Test Pass Criteria
43
Recommended Test Sequence
43
Power Cycling
44
Recommended Bios/Processor/Memory Test Procedures
44
Material and Recycling Requirements
44
Safety Requirements
45
Geometric Envelope for ATX Intel ® Reference Thermal Mechanical Design
45
ATX Reference Thermal Mechanical Solution for the Intel Pentium 4 Processor in the 775-Land LGA Package
46
Figure 10. Intel ® RCBFH-3 Reference Design
46
Table 4. Intel ® RCBFH-3 Reference Design Performance
46
Figure 11. Intel RCBFH-3 Reference Design (Exploded View)
47
Reference Attach Mechanism
48
Structural Design Strategy
48
Figure 12. Upward Board Deflection During Shock
48
Mechanical Interface to the Reference Attach Mechanism
49
Figure 13. Reference Clip/Heatsink Assembly
49
Figure 14. Critical Parameters for Interfacing to Reference Clip
51
Figure 15. Critical Core Dimension
51
6 Acoustic Fan Speed Control
53
Thermal Solution Design
53
Compliance to Thermal Profile
53
Determine Thermistor Set Points
53
Minimum Fan Speed Set Point
54
Figure 16. Thermistor Set Points
54
Board and System Implementation
55
Choosing Fan Speed Control Settings
55
Figure 17. Example Acoustic Fan Speed Control Implementation
55
Figure 18. Fan Speed Control
56
Temperature to Begin Fan Acceleration
56
Figure 19. Temperature Range = 5 °C
57
Figure 20. Temperature Range = 10 °C
58
Minimum PWM Duty Cycle
58
Combining Thermistor and Thermal Diode Control
59
Interaction of Thermal Profile and T
59
Figure 21. Diode and Thermistor
59
Appendix Alga775 Socket Heatsink Loading
61
LGA775 Socket Heatsink Considerations
61
Metric for Heatsink Preload for Atx/Μatx Designs Non-Compliant with Intel Reference Design
61
Heatsink Preload Requirement Limitations
61
Motherboard Deflection Metric Definition
62
Table 5. Board Deflection Configuration Definitions
62
Board Deflection Limits
63
Figure 22. Board Deflection Definition
63
Board Deflection Metric Implementation Example
64
Figure 23. Example: Defining Heatsink Preload Meeting Board Deflection Limit
64
Additional Considerations
65
A.2.5 Additional Considerations
65
Motherboard Stiffening Considerations
65
Heatsink Selection Guidelines
66
Appendix B Heatsink Clip Load Metrology
67
Overview
67
Test Preparation
67
Heatsink Preparation
67
B.1 Overview
67
B.2 Test Preparation
67
B.2.1 Heatsink Preparation
67
Figure 24. Load Cell Installation in Machined Heatsink Base Pocket (Bottom View)
68
Figure 25. Load Cell Installation in Machined Heatsink Base Pocket (Side View)
69
Figure 26. Preload Test Configuration
69
Typical Test Equipment
70
Test Procedure Examples
70
Table 6. Typical Test Equipment
70
Preload Degradation under Bake Conditions
71
Time-Zero, Room Temperature Preload Measurement
71
Appendix C Thermal Interface Management
73
Bond Line Management
73
Interface Material Area
73
Interface Material Performance
73
Appendix D Case Temperature Reference Metrology
75
Objective and Scope
75
Definitions
75
D.2 Definitions
75
Supporting Test Equipment
76
Thermal Calibration and Controls
77
IHS Groove
77
D.5 IHS Groove
77
Figure 27. 775-Land LGA Package Reference Groove Drawing
78
Figure 28. IHS Reference Groove on the 775-Land LGA Package
79
Figure 29. IHS Groove Orientation Relative to the LGA775 Socket
79
Thermocouple Attach Procedure
80
Thermocouple Conditioning and Preparation
80
Thermocouple Attachment to the IHS
80
Figure 30. Bending the Tip of the Thermocouple
80
Figure 31. Securing Thermocouple Wires with Kapton Tape Prior to Attach
81
Figure 32. Thermocouple Bead Placement
81
Figure 33. Position Bead on the Groove Step
82
Figure 34. Detailed Thermocouple Bead Placement
82
Figure 35. Using 3D Micromanipulator to Secure Bead Location
83
Figure 36. Measuring Resistance between Thermocouple and IHS
83
Curing Process
84
D.6.3 Curing Process
84
Figure 37. Applying the Adhesive on the Thermocouple Bead
84
Figure 38. Thermocouple Wire Management in the Groove
84
Figure 39. Removing Excess Adhesive from IHS
85
Figure 40. Filling the Groove with Adhesive
85
Thermocouple Wire Management
86
Figure 41. Thermocouple Wire Management
86
Appendix E Board Level PWM and Fan Speed Control Requirements
87
Table 7. FSC Definitions
87
Figure 42. FSC Definitions Example
88
Table 8. ATX FSC Settings
89
Table 9. Balanced Technology Extended (BTX) FSC Settings
89
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations
91
Figure 43. System Airflow Illustration with System Monitor Point Area Identified
92
Figure 44. Thermal Sensor Location Illustration
92
Appendix G Mechanical Drawings
93
Figure 45. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height Restrictions
94
Figure 46. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height Restrictions
95
Figure 47. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height Restrictions
96
Figure 48. Reference Clip Drawings - Sheet 1
97
Figure 49. Reference Clip Drawings - Sheet 2
98
Figure 50. Reference Fastener - Sheet 1
99
Figure 51. Reference Fastener - Sheet 2
100
Figure 52. Reference Fastener - Sheet 3
101
Figure 53. Reference Fastener - Sheet 4
102
Figure 54. Clip/Heatsink Assembly
103
Figure 55. Intel(R) RCBFH-3 Reference Solution Assembly
104
Appendix H Intel Enabled Reference Solution Information
105
Table 10. Intel Representative Contact for Licensing Information
105
Table 11. Intel Reference Component Thermal Solution Provider
105
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