Energy Efficiency - Compaq BL10e - HP ProLiant - 512 MB RAM Introduction Manual

configuration. A single Onboard Administrator module provides four services for the entire enclosure:
discovery, identification, management, and control. An optional second Onboard Administrator in the
c7000 enclosure provides complete redundancy for these services.
ProLiant server blades and BladeSystem enclosures include enterprise-class technologies that support
reliability, serviceability, and availability:
• Hot-plug disk drives – SAS, SATA, and in the future, solid state drives (SSD)
choose the level of flexibility, performance, cost, and availability they need
• Network interconnects – Embedded multifunction Gigabit Ethernet that use TCP/IP offload engine
(TOE) technology provide higher availability by offloading TCP/IP network stack processing. HP
10 Gigabit network interconnects that use HP advanced Flex-10 NIC technology can partition the
wide pipeline of a 10 Gb connection into four smaller pipelines, enabling redundancy and
availability.
• Processor socket technology – The latest Intel AMD processor packages use Land Grid Array (LGA)
socket technology to enable higher CPU bus speeds. To prevent damage to the delicate processor
socket pins, HP engineers developed a special tool to simplify and ease processor installation.
• Integrated Lights-Out (iLO) management – HP BladeSystem c-Class employs iLO 2 processors to
configure, update, and operate individual server blades remotely. The iLO management processor
resides on the system board, using auxiliary power and operating independently of the host
processor and the OS. Because it is independent of the OS, iLO is fully operational during server
blade shut-downs and reboots. It does not depend on the host processor for operation; it is
autonomous from the server hardware; and it can perform out-of-band management without any
assistance from the OS.
• Multiple I/O connectivity options:
– Local direct-attached storage devices
– SAS switches
– Smart Array controllers that support RAID levels 0, 1, 1+0, 5, 6 with ADG, 50, and 60 with
optional Battery-Backed Write Cache (BBWC) for availability

Energy efficiency

Because of their shared power and cooling, server blades across the industry use less power than
their rack-mounted counterparts; and HP has invested significant resources in making the BladeSystem
c-Class an exemplar of the savings possible when sharing power and cooling resources.
The efficient BladeSystem c-Class architecture addresses the concern of balancing performance
density with the power and cooling capacity of the data center. Thermal Logic technologies—
mechanical features and control capabilities throughout the BladeSystem c-Class—enable IT
administrators to optimize their power and thermal environment. HP Thermal Logic uses built-in
instrumentation, accurate monitoring and control, and the ability to pool, share and allocate power to
ensure the amount of power and cooling matches the demand.
In the first half of 2009, HP expects to introduce hot-plug SSDs using standard drive carriers that will be
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supported across the ProLiant product family.
7 allow customers to
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