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16. Do not use the product in the following locations.
• Locations where dust or corrosive gases (in particular, sulfuric or ammo-
nia gas) are present.
• Locations where icing or condensation may occur.
• Locations exposed to direct sunlight.
• Locations subject to excessive shock or vibration.
• Locations where the product may come into contact with water or oil.
• Locations subject to direct radiant heat from heating equipment.
• Locations subject to extreme temperature changes.
17. Cleaning: Do not use thinners. Use commercially available alcohol.
18. Use the specified cables for the communications lines and stay within the
specified DeviceNet communications distances.
19. Do not pull the DeviceNet communications cables with excessive force or
bend them past their natural bending radius.
20. Do not connect or remove connectors while the DeviceNet power is being
supplied. Doing so will cause product failure or malfunction.