Encoder Connectors - Texas Instruments C2000 F28P55 Series User Manual

Hardware
Table 2-1 describes the usage of the different removable shunts on the LaunchPad board.
Shunt Identifier
JP1, +5V0
JP1, GND
JP2, +5V0
JP2, +3V3
2.1.1.2 LEDs
Power indicator LEDs (red) are included on the F28P55x LaunchPad board.
each LED.
LED NO.
LED7
LED0
LED1
LED6
Two user LEDs are provided on the board: LED4 (red) and LED5 (green). These user LEDs are connected to
GPIO20 and GPIO21 of the F28P55X, respectively. The signals are connected to the SN74LVC2G07DBVR LED
driver IC and are connected in an active low configuration; that is, drive the GPIO low to turn on the LED and
high to turn off. These LEDs are dedicated for use by the software application.
Two blue LEDs, LED2 and LED3, are connected to the XDS110 debug probe. These indicate debugger activity
and are not controllable by any application software.

2.1.1.3 Encoder Connectors

The F28P55x LaunchPad includes two headers, J12 and J13, which are used for connecting linear or rotary
incremental encoders. These headers take 5V input signals that are stepped down to 3.3V and wired to the
F28P550SJ9 MCU. These signals are connected to the eQEP modules on the device when switch S5 is set
appropriately, see Table 2-5. Each header has the EQEPA, EQEPB, and EQEPI signals available for each eQEP
module (1 and 3) as well as pins for GND and 5V.
If present, the EQEP2 on the LaunchPad silk screen corresponds to the EQEP module 3.
2.1.1.4 FSI
The F28P55x MCU features the Fast Serial Interface (FSI) communications peripheral. The FSI enables robust
high-speed communications and is intended to increase the amount of information transmitted while reducing the
cost to communicate over an isolation barrier. The FSI signals TXCLK, TXD0, TXD1, RXCLK, RXD0, and RXD1
are available on J11. This header is set up in such a way that adding jumpers on the pins connects the TX to RX
channels for external loopback and evaluation. Additionally, there are two GND signals on the connector that can
be used for a wrapped-pair connection to an external board with FSI. The GPIOs connected to this header are
only routed to the J11 FSI connector on this board, and not routed to the Boosterpack headers.
The LAUNCHXL-F28P55X does not include any on-board isolation devices for the FSI signals. If interested
in evaluating the FSI peripheral with isolation devices, or differential drivers and receivers, then see the
TMDSFSIADAPEVM plug on board.
6 C2000 F28P55x Series LaunchPad Development Kit
Table 2-1. Power Domain Shunts
Connects the +5 V power from the USB-C connector (+5V0_USB) to the +5 V power on
the XDS110 side of the board (+5V0_XDS110). Bridges the power and ground isolations
between the two board sides.
Connects the board Ground on the isolated USB-C connector side of the board (USB_GND)
to the rest of the board ground (GND). Bridges the power and ground isolations between the
two board sides.
Connects the +5 V power on the XDS110 side of the board (+5V0_XDS110) to the +5 V
power on the F28P55X side of the board (+5V0_MCU).
Connects the +3.3 V power on the XDS110 side of the board (+3V3_XDS110) to the +3.3 V
power on the F28P55X side of the board (+3V3_MCU).
Table 2-2. Power LED Indication Descriptions
+5 V power from the USB Type-C connector
+3.3 V power on the XDS110 side of the PCB
+3.3 V power on the F28P55x side of the PCB
+5 V power on the F28P55x side of the PCB
Note
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Usage Description
Table 2-2 shows descriptions of
Indication Decription:
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SPRUJC0 – APRIL 2024
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