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(4) Apply flux to the PC board.
Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the IC's leads are to
be soldered.
Be careful
to apply minimum
amount
of flux
required so as not to smear it on unwanted areas.
ed
About 2.5 mm
(5) Temporarily tighten the IC
Carefully align the pattern and IC's leads, so that
the IC will be temporarily tightened to the pattern
on the four leads at the corners. At this time, sol-
dering is required, but no need to apply soldering
material.
(6) Apply flux to IC's leads
Apply flux to the areas of IC's leads where soldering
is to be performed. Be careful not to smear flux on
the root portion of any lead or the body of IC.
Apply flux only to
this portion.
(7) Soldering
While attaching the tip of the soldering iron to the
soldering point as shown in the illustration, feed 2
—Smm of soldering wire. Then, slowly move the
iron in the direction indicated by the arrow in the
illustration, so that the leads will be soldered to
the pattern. Move the iron in the rate.of approxi-
mately lcm in Ssec. Proceed with your work
while confirming a clean fillet of solder is formed
on each lead, subsequent to the melting of flux.
Soldering wire
Ic
>
Soldering iron
CAUTION
1) If you move the iron too quickly, loose soldering is
likely to result.
(8) Check the results
When soldering of all leads is finished, check the
soldered portion on every lead with a magnifying
glass. A tester must not be used or checking of
any soldered position
3. Safety-check out (U.S.A. model)
After correcting the original service problem, perform the
following safety check before releasing the set to the
customer:
Connect the insulating-resistance tester between the plug
of power supply cable and chassis.
Specifications: more than 10Mohm at SOOV.
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