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MODEL IDENTIFICATION
– Back Panel –
Model
DZ290M
DZ285K
DZ585K
DZ590M
DZ690M
DZ685K
HCD-DZ285K/DZ290M/DZ585K/DZ590M/DZ685K/DZ690M
Parts No.
Part No.
4-113-459-1[]
4-113-459-2[]
4-113-460-9[]
4-113-461-1[]
NOTES ON CHIP COMPONENT REPLACEMENT
4-122-167-1[]
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4-122-167-9[]
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FLEXIBLE CIRCUIT BOARD REPAIRING
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•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Unleaded solder has the following characteristics.
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•
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Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Keep the temperature of soldering iron around 270 °C during
repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
3
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