Sony HCD-G2BNiP Service Manual page 29

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in
this diagrams.
• Indication of transistor.
C
Q These are omitted.
B E
• Abbreviation
AUS : Australian model
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
HCD-G2BNiP/G2NiP
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• 2 : Nonfl ammable resistor.
• C : Panel designation.
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– BD94DC Board –
no mark : CD PLAY
– Other Boards –
no mark : TUNER FM
( ) : CD PLAY
< > : TUNER DAB
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: TUNER
F
J : CD PLAY
surface
d : USB
: AUDIO IN
f
L : DAB
G : LAN
• Abbreviation
AUS : Australian model
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Circuit Boards Location.
wireless LAN module
(MOD1)
NET board
BD94DC board
FL-NET board
USB board
HP board
JOG2 board
29 29
HCD-G2BNiP/G2NiP
TUNER board LAN board
module (DAB tuner) (DAB1)
DAB board (G2BNiP)
(G2BNiP)
MAIN board
DCDC board
MOTOR board
JOG1 board
SUB-PT board
AMP board