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5 Device Comparison
The following table summarizes the features of each device that is described in this data sheet.
FLASH /
(1) (4)
DEVICE NAME
SRAM (KB)
MSPM0G1505xPM
32 / 16
MSPM0G1506xPM
64 / 32
MSPM0G1507xPM
128 / 32
MSPM0G1505xPT
32 / 16
MSPM0G1506xPT
64 / 32
MSPM0G1507xPT
128 / 32
MSPM0G1505xRGZ
32 / 16
MSPM0G1506xRGZ
64 / 32
MSPM0G1507xRGZ
128 / 32
MSPM0G1505xRHB
32 / 16
MSPM0G1506xRHB
64 / 32
MSPM0G1507xRHB
128 / 32
MSPM0G1505xDGS28
32 / 16
MSPM0G1506xDGS28
64 / 32
MSPM0G1507xDGS28
128 / 32
MSPM0G1505xRGE
32 / 16
MSPM0G1506xRGE
64 / 32
MSPM0G1507xRGE
128 / 32
(1)
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in
(2)
Device Qualifications:
•
S = –40°C to 125°C
(3)
The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see
(4)
For more information about the device name, see
Copyright © 2023 Texas Instruments Incorporated
Table 5-1. Device Comparison
MATH
ADC /
(2)
QUAL
COMP
ACCEL
CHAN
S
Y
2 / 17
3
S
Y
2 / 16
3
S
Y
2 / 16
3
S
Y
2 / 11
3
S
Y
2 / 11
3
S
Y
2 / 9
3
Section 10.2
Product Folder Links:
MSPM0G1507 MSPM0G1506 MSPM0G1505
DAC
OPA
GPAMP
UART / I2C / SPI
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
1
2
1
4 / 2 / 2
Section
MSPM0G1507, MSPM0G1506, MSPM0G1505
SLASEW9B – FEBRUARY 2023 – REVISED AUGUST 2023
PACKAGE
TIMA TIMG GPIO
[PACKAGE SIZE]
64 LQFP
2
5
60
[12 mm × 12 mm]
48 LQFP
2
5
44
[9 mm × 9 mm]
48 VQFN
2
5
44
[7 mm × 7 mm]
32 VQFN
2
5
28
[5 mm × 5 mm]
28 VSSOP
2
5
24
[7.1 mm × 4.9 mm]
24 VQFN
2
5
20
[4 mm × 4 mm]
11, or see the
TI
website.
Section
11.
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(3)
5
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