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5 Device Comparison
FLASH /
(1) (4)
DEVICE NAME
SRAM
(KB)
M0G3105xPM
32 / 16
M0G3106xPM
64 / 32
M0G3107xPM
128 / 32
M0G3105xPT
32 / 16
M0G3106xPT
64 / 32
M0G3107xPT
128 / 32
M0G3105xRGZ
32 / 16
M0G3106xRGZ
64 / 32
M0G3107xRGZ
128 / 32
M0G3105xRHB
32 / 16
M0G3106xRHB
64 / 32
M0G3107xRHB
128 / 32
M0G3105xDGS28
32 / 16
M0G3106xDGS28
64 / 32
M0G3107xDGS28
128 / 32
M0G3105xRGE
32 / 16
M0G3106xRGE
64 / 32
M0G3107xRGE
128 / 32
M0G3105xDGS20
32 / 16
M0G3106xDGS20
64 / 32
M0G3107xDGS20
128 / 32
(1)
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in
11, or see the
TI
website.
(2)
Device Qualifications:
•
Q = –40°C to 125°C , AEC-Q100 qualified
(3)
The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances,
see
Section
11.
(4)
For more information about the device name, see
(5)
24,32 and 48 -pin VQFN package available with wettable flanks.
Copyright © 2023 Texas Instruments Incorporated
Table 5-1. Device Comparison
QUAL
ADC /
GPAMP
(2)
CHAN
Q
2 / 17
Q
2 / 16
Q
2 / 16
Q
2 / 11
Q
2 / 11
Q
2/9
Q
2 / 6
Section
Product Folder Links:
MSPM0G3107-Q1 MSPM0G3106-Q1 MSPM0G3105-Q1
MSPM0G3107-Q1, MSPM0G3106-Q1, MSPM0G3105-Q1
UART / I2C /
CAN
SPI
1
4 / 2 / 2
1
1
4 / 2 / 2
1
1
4 / 2 / 2
1
1
4 / 2 / 2
1
1
4 / 2 / 2
1
1
4 / 2 / 2
-
1
4 / 2 / 2
1
10.2.
SLASF86 – OCTOBER 2023
PACKAGE
TIMA
TIMG
GPIO
[PACKAGE SIZE]
64 LQFP
2
5
60
[12 mm × 12 mm]
48 LQFP
2
5
44
[9 mm × 9 mm]
48 VQFN
2
5
44
[7 mm × 7 mm]
32 VQFN
2
5
28
[5 mm × 5 mm]
28 VSSOP
2
5
24
[7.1 mm ×
24 VQFN
2
5
20
[5 mm × 5 mm]
20 VSSOP
2
5
16
[5.1 mm ×
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(3)
(5)
(5)
4.9 mm]
(5)
4.9 mm]
Section
5
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