Lenovo 30F30010GE Hardware Maintenance Manual page 106

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System board
Prerequisite
Before you start, read Generic Safety and Compliance Notices, and print the following instructions.
CAUTION:
Avoid contact with hot components inside the computer. During operation, some components
become hot enough to burn the skin. Before you open the computer cover, turn off the computer,
disconnect power, and wait approximately 10 minutes for the components to cool.
For access, do the following:
1. Remove the side panel. See "Side panel" on page 61.
2. Lay the computer on its side for easier access to the system board.
3. Remove the following parts if any:
• Remove the CPU duct. See "CPU duct" on page 66.
• Remove the CPU front fan. See "Front CPU fan" on page 72.
• Remove the CPU rear fan. See "Rear CPU fan" on page 73.
• Remove the hard disk and lower PCI-Express fan. See "Hard disk drive and lower PCI-Express fan"
on page 75.
• Remove the front panel IO assembly. See "Front panel I/O assembly" on page 79.
• Remove the memory fan duct. See "Memory module and fan duct" on page 76.
• Remove the onboard M.2 solid-state drive and its heatsink kit. See "M.2 solid-state drive" on page
70.
• Remove the flex module in the flex bay. See "Flex module" on page 86.
• Remove the media card reader in the flex bay. See "Media card reader" on page 87.
• Remove the hard disk drive in the internal storage bay. See "Hard disk drive in the internal storage
drive bay" on page 67.
• Remove the NVLINK bridge. See "NVLINK bridge" on page 81.
• Remove the PCIe card. See "PCI-Express card and extender" on page 82.
• Remove the super capacitor module. See "Super capacity module" on page 89.
• Remove the fan of the flex bays. See "Flex module fan" on page 84.
• Remove the CPU heatsink. See "CPU heatsink" on page 97.
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ThinkStation P7 Hardware Maintenance Manual

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