Samsung Odyssey G7 LC27G7 T Series Service Manual page 31

Description
15
After lifting the top portion of the board,
disassemble the terminal part attached to
the bottom.
16
Check the attachment status of the GaP
pad during decomposition.
decomposition complete.
※ GAP PAD imprints must be carefully
assembled when reassembling. Heat
generation may occur during misassembly.
17
[JOG PCB DISASSEMBLY]
Disassemble FUNCTION by lifting it in the
direction of the arrow.
Picture Description
Disassembly and Reassemble
Screws
3-5