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CCD, OPE AND MONITOR CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB10073-001B
FOIL SIDE(B)
C5210
Q5205
C5206
C5207
C5209
R5210
L5201
L5202
Q5204
Q5202
15
1
CN201
30
16
<06>MONITOR
LYB10069-001B
TL7701
S7501
COMPONENT SIDE(A)
R7712
R7711
C7603
C7608
C7703
C7604
1
C7605
Q7702
Q7703
1
6
R7703
R7705
CN7701
COMPONENT SIDE(A)
FOIL SIDE(B)
L7603
C7601
TL7601
C7617
R7603
R7602
L7602
R7604
L7604
C7616
TL7603
R7610
R7609
3
1
C7615
IC7602
R7502
R7607
C7614
4
5
C7622
TL1
R7601
C7613
C7618
R7606
C7621
R7608
C7624
C7623
36
CN7603
C7607
C7609
(No.YF139)2-47
<04>OPE
LYB10069-001B
S401
D451
COMPONENT SIDE(A)
2-48(No.YF139)
FOIL SIDE(B)
R456
R454
J402
C455
CN402
24
1
R455
D453
L453
C451
C453
R451
L451
S403
S413
J402
L455
D455
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