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CCD, REAR AND OPE CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB20025-001B
<03>REAR
LYB20024-001C
S501
L506
2-41(No.YF124)
COMPONENT SIDE(A)
L5002
CN5001
FOIL SIDE(B)
CN503
C514
D501
D503
C513
L505
J502
R5002
L5001
Q5001
C5003
C5001
C5004
C5006
C5002
C5005
C5007
R5004
R5001
COMPONENT SIDE(A)
BT501
BT502
R508
R509
R503
R510
R507
C507
D504
R504
C510
C503
R513
C502
C504
R512
C501
J502
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