Denon HEOS HomeCinema HS2 Service Manual page 57

PROCEDURE AFTER REPLACING THE PCB.
g
The procedure after replacing the printed circuit boards is as follows.
(1) Change the resistor for setting the region.
NOTE : Use a tolerance of ± 1% (F product) for resistance.
Model Area
R53
HEOSHCHS2 11k
DHT-S516H 6.8k
See the PCB below.
(2) Be sure to replace the software with the latest version.
J6 C210 U42
C212 U46
TP67 R117 C449
C450
C228
R316 R313 R2
U15
R1 C59 C60 C196 C195
C1 R3 R104 R114 C197
C193
C2
R185 R183 TP27
L1
C31
A C32 TP290
C445 C444
TP4
TP6
R54 C446
J1 A TP12
R40 R376
C11
R37 R377
R39 C370
R41 R20 R53 R4 U18
R43 R12
R44 R62
TP17 Model : H EOSHCHS2 M AIN BOARD
R25
P/N : T65 1000007640
L34
A R32 R33 TP253
R14 Date : 20 17-12-05 L24
C267
R30 R327 C268
R38 R329 Ver : MP C269
R36 R330 R215 TP69
R334 R218
TP10 R336 TP300 TP299
TP11 R213 U17 7 1 J16
TP301 TP222 C275
D6 TP162 C161 TP225 TP226
TP170 C162
TP96 L33 E
TP16 C375 TP208 TP62 TP236
R275 R273
D7 TP98 R272 R259
R51 D10 TP227
D8 R343 TP68 R261
C262
R359
C379 R205
TP304 R207 C264
D5 C14 R353 E
TP18 R46
B 80 TP20 C8 TP19 R48 11 1 7 1 7 1 11
R53 R52 C10 C380 U33 R283
TP159 TP156 C9 R286
R49 TP157 B TP21
C7 TP155
R54
R50 CN4 J10 J8
R315
R318
b Notice for replacement of PCB ASSY for "HEOS HomeCinema HS2" and "DHT-S516H".
• The chip resistors that need to be replaced are under the shield case of the board assembly.
• To replace the chip resistor, you need to remove the shield case from the board assembly.
• When removing the shield case, there is a concern that the solder that attaches the shield case to the
board ASSY may break the other parts and damage the board ASSY.
• Please confirm the replacement work in Region Service before ordering the board assembly.
MAIN PCB
R54 R315 R318
300 10k 11k
1k 10k 24k
F F
27 Q11 Q10
1 55 R130
2 56
28
J7
TP65 R168 C101
TP48 C100
U26
Q13 Q12
C102 H C327
Aside TP282
C87 C98 D23
R161 C97 R166
R156 C89 C342
R157 C95 C91 U35
C341
H
C85
C94 R152
D15
C86
C392 TP259 TP260
C401 C393 C353
U10 G R311 G
ZD3 C390
C391 R281R284
C405
C265 C258
C250 C244
C198 ZD2 C251 C316
C204 Q25
C216 C207 C289 R280
C218 C388 R307
C206 C329 C331 R306 C328
C208 C205 TP276 R326 C334
L48 L44 L43 L39 TP261 L35
C279 C246 C238
C278 C245
C277 TP199 U48 J9 +
L32 C194
L37 TP203
U19
TP202
C242
U40 TP219 C188
U38
C243
C241 C397 C360 C350 C333 C318
C396 C338 C332
C359 C351
U3 TP198 C237
C239 L46 L45 L41 L40 C317
L14 TP220 TP154 L29
F C260 C240
R253 TP153
C215 R252 C320
R242 R251 TP152
R240
1 C256 R239
R260 L47 L50
J11
R266 U39 - + 4 1 J5
R270 IR
R269 C270 C178 1 2 L_TW 1 2 L_WF 1
J2 DC IN J15 TP267
CN5 F J12 1 2 C339 C323
Bside
R13
PROCEDURE AFTER REPLACING THE U-COM, ETC.
The procedure after replacing the u-COM (microprocessor), flash ROM, etc. is as follows.
PCB Name Ref. No.
Module 38 Network Module
Procedure after Replacement
A : The software has been written. The software is not written at the time of replacement.
B : The software has been written. The software may need to be rewritten by version updates. Check the
version.
C106
C221 C220
C300 TP24
R274 R303
C347 See "FIRMWARE UPDATE
C299 R196 26
U9 J14 C345
R301 2
R66 R172
C315 1
R64 25
C : The software has not been written. The software needs to be written after replacement.
TP66
C398
R309
L27 L26 TP252 R308
See "3. Updating via
TP244 Q14
L11
C305 C295 C248
C304
C294 C288 C247 J4
L28
TP262 L21
settings update procedures" for information on writing the software.
TP266 L25 TP254
TP2 TP26
2 R_TW 1 2 R_WF D : The software has been written. Be sure to rewrite with the latest software for your service region.
J3 J13
See "3. Updating via
settings update procedures" for information on rewrite the software.
57
Procedure
Description
after Re-
placement
C/D
PROCEDURE" for information on writing the software.
USB", "1. Service region settings update procedures" and
USB", "1. Service region settings update procedures" and
Remark
SOFTWARE : Network
Be sure to update the firmware.
Be sure to rewrite the service
region setting.
Be sure to rewrite the service
Release Type setting.
"2. Service Release Type
"2. Service Release Type