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4-3.Correction with a Soldering Iron
1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of
the components will decrease because the extreme temperature change can cause deformations inside the
components. In order to prevent mechanical damage to the components, preheating is required for both
the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip",
"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the
PCB), should be within the conditions of table 3. It is required to keep the temperature differential
between the soldering Iron and the component surfaces (ΔT) as small as possible.
2. After soldering, do not allow the component/PCB to rapidly cool down.
3. The operating time for the re-working should be as short as possible. When re-working time is too long,
it may cause solder leaching, and that will cause a reduction in the adhesive strength of the terminations.
Table 3
Part Number
GC□03/15/18/21/31
GC□32
*Applicable for both Pb-Sn and Lead Free Solder.Pb-Sn Solder: Sn-37Pb
4. Optimum Solder amount when re-working with a Soldering lron
4-1. In case of sizes smaller than 0603, (GC□03/15/18),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component or 0.5mm whichever
is smaller. In case of 0805 and larger sizes, (GC□21/
31/32), the top of the solder fillet should be lower
than 2/3's of the thickness of the component. If the
solder amount is excessive, the risk of cracking is higher
during board bending or under any other stressful condition.
4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep the soldering
iron from touching the components during the re-work.
4-3. Solder wire with ø0.5mm or smaller is required for soldering.
4-4.Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,
chips may crack and solder joints may break.
Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.
JEMCGC-2702N
Temperature
Preheating
of Soldering
Temperature
Iron tip
350℃ max.
150℃ min.
280℃ max.
150℃ min.
Lead Free Solder: Sn-3.0Ag-0.5Cu
Temperature
Differential
Atmosphere
(ΔT)
ΔT≦190℃
Air
ΔT≦130℃
Air
19
Caution
!
Solder Amount
in section
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