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CHIP MONOLITHIC CERAMIC CAPACITOR FOR AUTOMOTIVE
GCM188R71E103KA37_ (0603, X7R, 10000pF, 25Vdc)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GCM
18
(1)L/W
Dimensions
3. Type & Dimensions
L
W
T
e
g
e
(1)-1 L
(1)-2 W
1.6±0.1
0.8±0.1
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P4
f330mm Reel
J
PAPER W8P4
Product specifications in this catalog are as of Jan.25,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GCM188R71E103KA37-01
8
R7
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
0.8±0.1
0.2 to 0.5
(4)
DC Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 125 °C
25 Vdc
(25 °C)
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
1E
103
(6)Capacitance
(4)DC Rated
(5)Nominal
Tolerance
Voltage
Capacitance
(Unit:mm)
e
g
0.5 min.
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
10000 pF
±10 %
1
Reference Sheet
K
A37
(7)Murata's
(8)Packaging
Control Code
Specifications and Test
Methods
(Operationg
Temp. Range)
-55 to 125 °C
D
Code
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Related Manuals for Murata GCM188R71E103KA37 Series
Summary of Contents for Murata GCM188R71E103KA37 Series
- Page 1 CHIP MONOLITHIC CERAMIC CAPACITOR FOR AUTOMOTIVE GCM188R71E103KA37_ (0603, X7R, 10000pF, 25Vdc) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s (2)T (6)Capacitance (8)Packaging (1)L/W...
- Page 2 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type Pre-and Post-Stress Electrical Test 2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at 150±3℃. Set for Exposure (Storage) specifications in the following table.
- Page 3 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type The measured and observed characteristics should satisfy the 7 Operational Life Apply 200% of the rated voltage for 1000±12 hours at 125±3℃(for Δ...
- Page 4 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type 14 Thermal Shock The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under specifications in the following table.
- Page 5 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type 18 Board Flex Appearance No marking defects Solder the capacitor on the test jig (glass epoxy board) shown in Fig1 using a eutectic solder. Then apply a force in the direction shown in Fig 2 for 5±1sec.
- Page 6 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Item AEC-Q200 Test Method Temperature High Dielectric Type Compensating Type R7 : Within ±15% 21 Capacitance Capacitance Within the specified tolerance. The capacitance change should be measured after 5 min. at each specified temperature stage.
- Page 7 Package GC□ Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GC□03 15000(W8P2) 30000(W8P1) 50000(W8P2) GC□15 10000(W8P2) 20000(W8P1) 50000(W8P2) GC□18 4000 10000 4000 10000 GC□21...
- Page 8 Package GC□ Type (3)GC□18/21/31/32 T:0.85 rank max. (in:mm) 4.0±0.1 4.0±0.1 2.0±0.1 +0.1 φ1.5 Ａ 1.1 max. Code GC□18 GC□21 GC□31 GC□32 1.05±0.1 1.55±0.15 2.0±0.2 2.8±0.2 1.85±0.1 2.3±0.15 3.6±0.2 3.6±0.2 (4)GC□21/31/32 T:1.15 rank min. (in:mm) 4.0±0.1 4.0±0.1 0.25±0.1(T≦2.0mm) 2.0±0.1 0.3±0.1(T：2.5mm) +0.1 φ1.5 Ａ...
- Page 9 め状態 ( 単位： mm) Package GC□ Type Fig.1 Package Chips (in:mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GC□32 max. 16.5 max. 10±1.5 20.5 max. GC□43/55 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
- Page 10 Package GC□ Type ﾁｯﾌﾟ詰め状態 ( 単位： mm) 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. (in:mm) Tail vacant Section Chip-mounting Unit...
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Page 11: Limitation Of Use
Caution ■ Limitation of use Please contact our sales representatives or product engineers before using our products for the applications listed below which require of our products for other applications than specified in this product. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment ⑧Disaster prevention / crime prevention equipment... - Page 12 Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to insure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range.
- Page 13 Caution 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
- Page 14 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit. 1-1.
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Page 15: Vibration And Shock
Caution 7.Vibration and Shock 1. The capacitors mechanical actress (vibration and shock) shall be specified for the use environment. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. - Page 16 Caution 2.Information before mounting 1. Do Not re-use capacitors that were removed from the equipment. 2. Confirm capacitance characteristics under actual applied voltage. 3. Confirm the mechanical stress under actual process and equipment use. 4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5.
- Page 17 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Infrared Reflow deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering...
- Page 18 Caution 4-2.Flow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Flow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) Soldering Soldering Peak mechanical damage in the components, preheating should...
- Page 19 Caution 4-3.Correction with a Soldering Iron 1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board.
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Page 20: Not Recommended
Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board. - Page 21 Caution 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is caused by bending or twisting the board. 1-1. In cropping the board, the stress as shown right may cause the capacitor to crack. Try not to apply this type of stress to a capacitor.
- Page 22 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of a electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
-
Page 23: Operating Temperature
Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1.Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature which will cover the operating temperature range. -
Page 24: Pcb Design
Notice ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. - Page 25 Notice 2. Land Dimensions Chip Capacitor Land 2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
- Page 26 Notice 2.Adhesive Application 1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering. The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding strength. The chip's electrode thickness and land thickness must also be taken into consideration.
- Page 27 Notice 6.Washing 1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality and select the applicable solvent. 2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 3.
- Page 28 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.