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This unit utilizes a class III a laser. Visible laser radiation is emitted
from the optical pickup lens when the unit is turned on:
1. Do not look directly into the pickup lens.
2. Do not use optical instruments to look at the pickup lens.
3. Do not adjust the preset variable resistor on the optical pickup.
4. Do not disassemble the optical pickup unit.
5. If the optical pickup is replaced, use the manufactures specified
replacement pickup only.
6. Use of control or adjustment or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
3. PREVENTION OF ELECTROSTATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical
ES devices are integrated circuits and some field-effect transistorsare semiconductor "chip"
components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your
body touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging ESD wrist strap,
whichshould be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder
removal devices not classified as "anti-static (ESD protected)"
can generate electrical charge sufficient to damage ES devices.
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