LG -E435 Service Manual page 185

Level LocationNo.
IC,Digital
6 U2000 Baseband
Processor,3G
6 U9001 IC,WiFi
6 U1003 IC,Power Amplifier
6 U1001 IC,Power Amplifier
6 U3001 IC,MCP,eMMC
IC,Acceleration
6 U6000
Sensor
6 6 U1002 U1002 IC,Power Amplifier IC Power Amplifier
Oscillator
6 X2000
VCTCXO
C1041
C1048 Capacitor
6
C9018 Ceramic,Chip
C9025
Capacitor
6 C7008
Ceramic,Chip
Capacitor
6 C1105
Ceramic,Chip
LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
EAN62405911
EAN62416201
EAN62657401
EAN62633501
EAN62635901
EAN62637201
EAN62676401 10P 3 3, 3G Band1 for QCT, 3mode(13,20,26dB), EAN62676401
EAW61903801
ECCH0000110
ECCH0000112
ECCH0000113
Spec
MSM7225A-0-AB
576NSP,11x11,ARMv7(1GHz),HSDPA(DPA7.2,UP
A5.76), HVGA LCD, VGA30fps,5MP,MIPI CSI_DSI
NSP R/TP 576P QUALCOMM INCORPORATED.
WCN1314-0-87WLNSP-TR-0D WCN1314 Revision
version, WiFi(11bgn) signle band, 3.95x4.16x0.63,
0.4pitch, 65nm, WLCSP R/TP 87P QUALCOMM
INCORPORATED.
RF7228 3.0V to 4.35V 0 0 0W 0W 0 1 SMD R/TP
10P 3*3, 3G Band8 for QCT, 3mode(13,18,30dB),
41% at 28.5dBm RF MICRO DEVICES INC
SKY77584 - - - 0W 0W - 0 SMD R/TP 28P -
SKYWORKS SOLUTIONS INC.
KMS5U000KM-B308 FLASH
2.7VTO3.6V,1.7VTO1.95V 11.5x13.0x0.9 TR 153P
MLC NAND FBGA 4GB eMMC v4.41+4Gb LPDDR1
MCP (21nm 32Gb TLC+35nm 2Gb LPDDR1x2)
SAMSUNG ELECTRONIC CO.,LTD
BMC150 Accelerometer with Geomagnetic Sensor
2.2X2.2X1.0 LGA R/TP 14P Accelerometer with
Geomagnetic Sensor BOSCH SENSORTEC
GMBH
RF7221 3.0V to 4.35V 0 0 0W 0W 0 1 SMD R/TP
10P 3*3 3G Band1 for QCT 3mode(13 20 26dB)
41% at 28.0dBm RF MICRO DEVICES INC
1XXA19200FBB 19.2MHZ 2PPM 2.8V
2.5x2.0x0.8MM - SMD R/TP DAISHINKU
CORPORATION.
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
MCH155C150J 15pF 5% 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
MCH155A180J 18pF 5% 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
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