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RHB0032E
A
PIN 1 INDEX AREA
1 MAX
0.05
0.00
28X 0.5
2X
3.5
PIN 1 ID
(OPTIONAL)
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
5.1
4.9
2X 3.5
3.45 0.1
9
8
33
1
32
SYMM
SCALE 3.000
B
5.1
4.9
C
EXPOSED
16
THERMAL PAD
17
SEE SIDE WALL
SYMM
0.3
32X
0.2
24
0.1
0.05
25
0.5
32X
0.3
www.ti.com
PACKAGE OUTLINE
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.1)
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
20.000
SEATING PLANE
0.08 C
(0.2) TYP
DETAIL
C A B
C
4223442/B 08/2019
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