HTC SkyWriter Service Manual page 83

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3. Use small soldering iron to remove remaining underfill, then use chemistry liquid of
Acetone to clear the CSP surface of PCB.
Use small soldering
iron to remove
remaining
4. All the remaining underfill be cleared, the CSP can be re-solder in place.
5. Send the PCB to Underfill machine to do re-underfill.
HTC confidential
© 2008 HTC CORPORATION. ALL RIGHTS RESERVED.····························································
TOTAL 83
宏達國際電子股份有限公司
HTC Corporation
SkyWriter Service Manual
PAGE NO. 83
Doc. No.
DOC-00045404
Issued Date
2008/08/18
Revised Date
2008/08/15
Page
83 of 83
Use Acetone to clear
the CSP surface of
PCB
REV.
A01

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