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2.
Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits. The following illustration shows the replacement thermal
material locations.
Thermal paste is used on one system board component (1) and on the heat sink area (2) that services it.
Reverse this procedure to install the heat sink.
Lock bracket
To remove the lock bracket, use this procedure and illustration.
Table 5-9
Lock bracket description and part number
Description
Lock bracket
Before removing the lock bracket, follow these steps:
1.
Prepare the computer for disassembly (see
2.
Remove the bottom cover (see
3.
Remove the battery (see
Remove the lock bracket:
1.
Remove the Phillips M2.0 × 3.0 screw (1) that secures the lock bracket to the computer.
Preparation for disassembly on page
Bottom cover on page
Battery on page
27).
26).
Component replacement procedures
Spare part number
M00433-001
26).
35
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