Thermal Considerations And Mounting Method; Thermal Consideration - TDK-Lambda PFH500 Series Instruction Manual

TDK-Lambda
PFH500-SERIES
INSTRUCTION MANUAL
7

Thermal Considerations and Mounting Method

7.1

Thermal Consideration

The PFH Series module is designed for both convection and conduction cooling applications.
This product can be mounted in any orientation, but for forced convection applications, be sure to provide adequate airflow
around the power supply to avoid heat accumulation. Consider layout of surrounding components and orient the PFH such
that air flow across module is optimized.
It is recommended that this product operate when case temperature is maintained at or below the derating curves as shown
in Figure 7-2. The maximum case temperature should be 100C or less regardless of the input operating line voltage and/or
frequency. For any technical issues related to thermal derating, thermal test set-up, mounting, the heat sink attachment,
and use of the thermal interface material, please contact TDK-Lambda Americas for technical support.
Case temperature thermal measurement location is shown in Fig. 7-1.
Thermal Measurement
Location
Fig. 7-1 Baseplate Temperature Measuring Point.
To achieve a more rugged physical design and minimize common mode noise, the PFH Series module is constructed
without an Insulated Metal Substrate (IMS) board. Instead the PFH construction comprises of a multi-layer, heavy Cu PCB
enclosed within a 5-sided insulated case.
REV 2.8 (March 30, 2020) 27