TYAN TN70E-B7106 Service Engineer's Manual page 19

Computer barebone
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LEDs
I/O Ports
Type / Q'ty
External Drive
Bay
HDD backplane support SAS 12Gb/s, SATA 6Gb/s, NVMe
Supported HDD Interface (8) SATA 6Gb/s + (4) NVMe
System
Cooling
FAN
Configuration
Type
Input Range
Frequency
Output Watts
Power Supply
Efficiency
Redundancy
Socket Type / Q'ty
Supported CPU Series
Thermal Design Power
Processor
(TDP) wattage
System Bus
Chipset
PCH
Supported DIMM Qty
DIMM Type / Speed
Memory
Capacity
Memory channel
Memory voltage
Expansion
PCI-E
Slots
(1) ID, (1) UID, (1) BMC event
(2) USB 2.0 ports
(8) 3.5"/2.5" Hot-Swap SSD/HDD +
(4) NVMe
(2)2.5" Hot-Swap SSD
(8) 6cm fans
RPSU
AC 100-127V/10A, AC 200-240V/5A
50-60 Hz
770 Watts
80 plus Platinum
1+1
Note: The system supports redundant
PSU operation if the CPU's TDP equal or
less than 165W
LGA3647/ (2)
Intel Xeon Processor Scalable Families
Max up to 205W
Up to 10.4/9.6 GT/s with Intel UltraPath
Interconnect (UPI) support
Intel C621
(8)+(8) DIMM slots
DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS 2666
Up to 512GB RDIMM/ 1,024GB LRDIMM/
768GB LRDIMM 3DS *Follow latest Intel
DDR4 Memory POR
6 Channels per CPU
1.2V
(2) sets of the following expansion
combination :
(2) PCI-E Gen3 x8 slots
(1) PCI-E Gen3 x16 slots (w/ x8/x16 link)
Note: The total power consumption of the
19
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