Glossary - Motorola ASTRO XTS 3000 Service Manual

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Glossary

68P81083C85-A March 2004
A/D — Analog to Digital converter; converts an instantaneous dc voltage
level to a corresponding digital value.
Abacus IC — Custom integrated circuit providing a digital receiver IF backend.
ADSIC — ABACUS/DSP Support IC; custom integrated circuit providing
peripheral functions for the DSP.
ALC — Automatic Level Control; a circuit in the transmit RF path that
controls RF power amplifier output, provides leveling over frequency and
voltage, and protects against high VSWR.
D/A — Digital to Analog converter; converts a digital value to a corresponding dc voltage value.
DTMF — Dual Tone Multi-Frequency
DPL — Digital Private-Line™
DSP — Digital Signal Processor; microcontroller specifically tailored for signal processing
computations. In this case refers specifically to Motorola DSP56001.
Firmware — Software or a software/hardware combination of computer
programs and data, with a fixed logic configuration stored in a read-only memory;
information can not be altered or reprogrammed.
FGU — Frequency Generation Unit
FLASHPort™ — A Motorola term that describes the ability of a radio to change
memory. Every FLASHport radio contains a FLASHport EEPROM memory chip
that can be software written and rewritten to, again and again.
Host — Motorola HC11F1 microcontrol unit U204 (see MCU).
Host Port — Parallel memory mapped interface consisting of eight registers in the DSP56001.
IC — Integrated Circuit
IMBE — A sub-band, voice encoding algorithm used in ASTRO digital voice.
ISW — Inbound Signalling Word; data transmitted on the control channel from
a subscriber unit to the central control unit.
LSH — Low Speed Handshake; 150 baud digital data sent to the radio during
trunked operation while receiving audio.
MCU — MicroControl Unit
MDC — Motorola Digital Communications
MISO — Master In Slave Out; used by the slave device to send data to the master device.
MOSI — Master Out Slave In; used by the master device to send data to the slave device.
OMPAC — Over-Molded Pad-Array Carrier; a Motorola custom IC package,
distinguished by the presence of solder balls on the bottom pads.
Glossary
GL-1

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