Figure 3-11. Expander Power Distribution; Figure 3-12. Computer/Expander Motherboards - HP 330 Service Information Manual

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I/O BACKPLANE
Figure 3-11. Expander Power Distribution
Power supply outputs are distributed through the motherboard. Test points are located on the
motherboard and are accessible behind the front panel.
CAUTION
When custom designed accessory cards are being used in the DIO or
DIO-II slots, their power consumption must be added to all cards and
boards used in the unit. Information regarding the design of custom
accessory cards is contained in the HP 9000 Series 300 Model 330/350
Accessory Development Guide, part number 98562-90010.
When the DIO adaptors are installed, power is distributed through the ribbon cables fronl the
motherboard to these DIO backplanes connectors:
• Bottom connector on 2-s10t DIO adaptors .
• Bottom and next to top connector on 4-s10t DIO adaptors.
None of the other ribbon cable connectors have traces connecting power from the ribbon cable
to the DIO slots. DIO interface accessories will get power only when connected in the bottom
of each pair of DIO slots. Only data and control traces connect the top of each pair of DIO
slots to the bottoln one.
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Functional Description