SCHEMATIC DIAGRAMS
MICRO COMPONENT SYSTEM
UX-G68E,UX-G68EN,UX-G68EV
SP-UXG68
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade)
Contents
Block diagrams
Standard schematic diagrams
Printed circuit boards
CD-ROM No.SML200702
CA-UXG68
SUPER VIDEO
COPYRIGHT
2007 Victor Company of Japan, Limited.
SP-UXG68
2-1
2-2
2-10 to 12
No.MB595SCH
2007/2