Table Of Contents - Sony XR-CA610X Service Manual

Table of Contents

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XR-CA610X
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TABLE OF CONTENTS

1.
Location of Controls ....................................................... 3
2.
2-1. Disassembly Flow ........................................................... 9
2-2. Sub Panel Assy ................................................................ 9
2-3. Mechanism Deck (MG-25F-136) ................................... 10
2-4. MAIN Board ................................................................... 10
2-5. Heat Sink (2P) ................................................................. 11
3.
3-1. Assembly Flow ................................................................ 12
3-2. Housing ........................................................................... 12
3-3. Arm (Suction) ................................................................. 13
3-4. Lever (LDG-A)/(LDG-B) ............................................... 13
3-5. Gear (LDG-FT) ............................................................... 14
3-6. Guide (C) ......................................................................... 14
4.
5.
Tape Deck Section .......................................................... 17
Tuner Section .................................................................. 17
6.
6-2. Block Diagram - MAIN Section - ................................ 20
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L 13942296513
Schematic Diagrams ....................................................... 22
6-5. Printed Wiring Board - MAIN Board - ........................ 23
6-9. Printed Wiring Board - SUB Board - ........................... 27
6-10. Schematic Diagram - SUB Board - .............................. 27
6-11. Printed Wiring Board - KEY Board - ........................... 28
6-12. Schematic Diagram - KEY Board - ............................. 29
6-13. IC Pin Function Description ........................................... 32
7.
7-1. General Section ............................................................... 35
7-2. Front Panel Section ......................................................... 36
8.
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............................... 38
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Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
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