Sony HDCU1000 Maintenance Manual page 85

(AVP-6 BOARD suffix 12)
Ref. No.
or Q'ty Part No. SP Description
C159 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C160 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C161 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C162 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C163 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C164 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C165 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C166 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C167 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C168 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C169 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C170 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C171 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C172 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C173 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C174 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C175 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C176 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C177 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C178 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C179 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C200 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C201 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C202 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C203 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C204 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C205 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C206 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C207 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C208 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C300 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C301 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C302 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C303 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C304 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C305 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C306 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C307 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C308 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C309 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C310 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C311 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C312 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C313 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C314 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C315 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C316 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C317 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C318 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C319 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C320 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C321 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C322 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C323 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C324 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C325 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C326 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C327 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C328 1-165-989-91 s CAP, CERAMIC 10MF (2012)
MM/HDCU1000 Series
(AVP-6 BOARD suffix 12)
Ref. No.
or Q'ty Part No. SP Description
C329 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C330 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C331 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C332 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C333 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C334 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C335 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C336 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C337 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C338 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C339 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C340 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C341 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C342 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C343 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C344 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C345 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C346 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C347 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C348 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C349 1-164-854-81 s CAP, CHIP CERAMIC 15PF CH 1005
C350 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C351 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C352 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C353 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C354 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C355 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C356 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C357 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C358 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C359 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C360 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C361 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C362 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C363 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C364 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C365 1-164-854-81 s CAP, CHIP CERAMIC 15PF CH 1005
C366 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C367 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C368 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C369 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C400 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C402 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C403 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C404 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C405 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C406 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C407 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C408 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C409 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C410 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C411 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C412 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C413 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C414 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C415 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C416 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C417 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C418 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
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