Sony HDCU1000 Maintenance Manual page 164

(SDP-12 BOARD suffix 12)
Ref. No.
or Q'ty Part No. SP Description
C114 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C115 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C118 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C119 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C120 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C210 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C218 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C221 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C222 1-216-864-91 s CONDUCTOR, CHIP (1608)
C223 1-216-864-91 s CONDUCTOR, CHIP (1608)
C225 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C226 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C227 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C228 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C229 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C230 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C231 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C232 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C233 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C234 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C235 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C236 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C237 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C238 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C239 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C246 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C248 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C249 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C250 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C251 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C252 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C253 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C254 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C255 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C256 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C257 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C258 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C259 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C260 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C261 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C262 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C263 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C264 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C265 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C266 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C267 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C268 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C269 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C270 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C271 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C274 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C276 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C277 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C279 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
4-120
(SDP-12 BOARD suffix 12)
Ref. No.
or Q'ty Part No. SP Description
C404 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C405 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C406 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C407 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C408 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C409 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C410 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C412 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C413 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C415 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C416 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C417 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C418 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C420 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C421 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C422 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C423 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C424 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C425 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C426 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C427 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C428 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C429 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C430 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C431 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C432 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C433 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C434 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C435 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C436 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C437 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C438 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C439 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C440 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C441 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C442 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C445 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C446 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C447 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C448 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C449 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C450 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C451 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C452 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C453 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C454 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C455 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C456 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C457 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C458 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C459 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C460 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C461 1-216-864-91 s CONDUCTOR, CHIP (1608)
C462 1-216-864-91 s CONDUCTOR, CHIP (1608)
C475 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C479 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C482 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C483 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C484 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
MM/HDCU1000 Series